
InAs (100), undoped 30mm dia wafer 1sp - IAUa30D05C1US
- Growth method LEC
- Orientation (100) ± 0.5 Deg
- Doping Undoped
- Conductivity type N type
- Carrier Concentration <3E16 / cm3
- Mobility >20000 cm2/V.S
- EPD <5E4 / cm 2
- Standard thickness 500 ± 20 mm
- Standard diameter 30 mm
- Polish one-side
Related Product
| Other InAs |
InSb |
InP |
GaAs |
GaSb |
Wafer Box |
Film Coater |
RTP Furnaces |
Original: $599.00
-65%$599.00
$209.65InAs (100), undoped 30mm dia wafer 1sp - IAUa30D05C1US
- Growth method LEC
- Orientation (100) ± 0.5 Deg
- Doping Undoped
- Conductivity type N type
- Carrier Concentration <3E16 / cm3
- Mobility >20000 cm2/V.S
- EPD <5E4 / cm 2
- Standard thickness 500 ± 20 mm
- Standard diameter 30 mm
- Polish one-side
Related Product
| Other InAs |
InSb |
InP |
GaAs |
GaSb |
Wafer Box |
Film Coater |
RTP Furnaces |
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Description
- Growth method LEC
- Orientation (100) ± 0.5 Deg
- Doping Undoped
- Conductivity type N type
- Carrier Concentration <3E16 / cm3
- Mobility >20000 cm2/V.S
- EPD <5E4 / cm 2
- Standard thickness 500 ± 20 mm
- Standard diameter 30 mm
- Polish one-side
Related Product
| Other InAs |
InSb |
InP |
GaAs |
GaSb |
Wafer Box |
Film Coater |
RTP Furnaces |











