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InAs (100), Undoped, 2" dia x 0.5 mm, two sides polished
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InAs (100), Undoped, 2" dia x 0.5 mm, two sides polished

InAs (100), Undoped, 2" dia x 0.5 mm, two sides polished

2" InAs wafer (Ntype)

  • 2" InAs wafer:                   (Undoped, N type)
  • Size:                                  2" dia x 500 microns +/-25 microns
  • Orientation:                       <100> +/-0.50
  •  Polishing:                          two sides  polished
  • Growth Method:                LEC
  • Major Flat Orientation:     <1-10>
  • Minor Flat Orientation:     <0-11>
  • Mobility:                             (18000-20000) cm^2/V.s
  • Carrier Concentration:    < 3 E16 cm^-3
  • EPD:                                  <5000 /cm^2
  • Packing:                            in 1000 class clean room with wafer container


  • Related Product

    Other InAs

    InSb

    InP 

    GaAs


    GaSb



    Wafer Box

    Film Coater

    RTP Furnaces

     

$1,195.00
InAs (100), Undoped, 2" dia x 0.5 mm, two sides polished
$1,195.00

InAs (100), Undoped, 2" dia x 0.5 mm, two sides polished

2" InAs wafer (Ntype)

  • 2" InAs wafer:                   (Undoped, N type)
  • Size:                                  2" dia x 500 microns +/-25 microns
  • Orientation:                       <100> +/-0.50
  •  Polishing:                          two sides  polished
  • Growth Method:                LEC
  • Major Flat Orientation:     <1-10>
  • Minor Flat Orientation:     <0-11>
  • Mobility:                             (18000-20000) cm^2/V.s
  • Carrier Concentration:    < 3 E16 cm^-3
  • EPD:                                  <5000 /cm^2
  • Packing:                            in 1000 class clean room with wafer container


  • Related Product

    Other InAs

    InSb

    InP 

    GaAs


    GaSb



    Wafer Box

    Film Coater

    RTP Furnaces

     

Product Information

Shipping & Returns

Description

2" InAs wafer (Ntype)

  • 2" InAs wafer:                   (Undoped, N type)
  • Size:                                  2" dia x 500 microns +/-25 microns
  • Orientation:                       <100> +/-0.50
  •  Polishing:                          two sides  polished
  • Growth Method:                LEC
  • Major Flat Orientation:     <1-10>
  • Minor Flat Orientation:     <0-11>
  • Mobility:                             (18000-20000) cm^2/V.s
  • Carrier Concentration:    < 3 E16 cm^-3
  • EPD:                                  <5000 /cm^2
  • Packing:                            in 1000 class clean room with wafer container


  • Related Product

    Other InAs

    InSb

    InP 

    GaAs


    GaSb



    Wafer Box

    Film Coater

    RTP Furnaces

     

InAs (100), Undoped, 2" dia x 0.5 mm, two sides polished | MTI Online Store