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VGF-Ge Wafer(100) . 100 mmdia x 0.175 mm, 2SP, P type ( Ga doped) R:0.1-0.182 ohm.cm
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VGF-Ge Wafer(100) . 100 mmdia x 0.175 mm, 2SP, P type ( Ga doped) R:0.1-0.182 ohm.cm

VGF-Ge Wafer(100) . 100 mmdia x 0.175 mm, 2SP, P type ( Ga doped) R:0.1-0.182 ohm.cm

Ge Wafer Specification

  • Growing Method:                VGF
  • Orientation:                        (100) +/-0.5 Deg.
  • Wafer Size:                        100(+/_0.4) mm  dia x  175(+/_25) microns
  • Surface Polishing:              Both  sides  polished
  • Surface roughness:             < 8 A ( by AFM)
  • Doping:                             Ga Doped
  • Conductor type:                 P-type
  • Resistivity:                         0.51-0.182 ohm.cm (If you would like to measure the resistivity accurately, 
                                            please order our
     Portable 4 Probe Resistivity Testing Instrument.)
  • Carrier Concentration:         (0.188-1.13) x10^17
  • Mobility:                            1100-1830 cm^2/v.s.
  • EPD:                                 <=500 /cm^2 
  • Ra(Average Roughness) :    < 0.4 nm
  • Package:                           under 1000 class clean room      

Typical Properties:

  • Structure:                         Cubic, a = 5.6754Å
  •  Density:                           5.323 g/cm3 at room temperature
  • Melting Point:                    937.4 oC
  • Thermal Conductivity:         640

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$628.25

Original: $1,795.00

-65%
VGF-Ge Wafer(100) . 100 mmdia x 0.175 mm, 2SP, P type ( Ga doped) R:0.1-0.182 ohm.cm

$1,795.00

$628.25

VGF-Ge Wafer(100) . 100 mmdia x 0.175 mm, 2SP, P type ( Ga doped) R:0.1-0.182 ohm.cm

Ge Wafer Specification

  • Growing Method:                VGF
  • Orientation:                        (100) +/-0.5 Deg.
  • Wafer Size:                        100(+/_0.4) mm  dia x  175(+/_25) microns
  • Surface Polishing:              Both  sides  polished
  • Surface roughness:             < 8 A ( by AFM)
  • Doping:                             Ga Doped
  • Conductor type:                 P-type
  • Resistivity:                         0.51-0.182 ohm.cm (If you would like to measure the resistivity accurately, 
                                            please order our
     Portable 4 Probe Resistivity Testing Instrument.)
  • Carrier Concentration:         (0.188-1.13) x10^17
  • Mobility:                            1100-1830 cm^2/v.s.
  • EPD:                                 <=500 /cm^2 
  • Ra(Average Roughness) :    < 0.4 nm
  • Package:                           under 1000 class clean room      

Typical Properties:

  • Structure:                         Cubic, a = 5.6754Å
  •  Density:                           5.323 g/cm3 at room temperature
  • Melting Point:                    937.4 oC
  • Thermal Conductivity:         640

Related Product

Other Crystal wafer A-Z

Plasma Cleaner

 Wafer Containers

Dicing saw

Film Coater

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Description

Ge Wafer Specification

  • Growing Method:                VGF
  • Orientation:                        (100) +/-0.5 Deg.
  • Wafer Size:                        100(+/_0.4) mm  dia x  175(+/_25) microns
  • Surface Polishing:              Both  sides  polished
  • Surface roughness:             < 8 A ( by AFM)
  • Doping:                             Ga Doped
  • Conductor type:                 P-type
  • Resistivity:                         0.51-0.182 ohm.cm (If you would like to measure the resistivity accurately, 
                                            please order our
     Portable 4 Probe Resistivity Testing Instrument.)
  • Carrier Concentration:         (0.188-1.13) x10^17
  • Mobility:                            1100-1830 cm^2/v.s.
  • EPD:                                 <=500 /cm^2 
  • Ra(Average Roughness) :    < 0.4 nm
  • Package:                           under 1000 class clean room      

Typical Properties:

  • Structure:                         Cubic, a = 5.6754Å
  •  Density:                           5.323 g/cm3 at room temperature
  • Melting Point:                    937.4 oC
  • Thermal Conductivity:         640

Related Product

Other Crystal wafer A-Z

Plasma Cleaner

 Wafer Containers

Dicing saw

Film Coater

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