
DC/RF 4-Head 2" High Vacuum Magnetron Plasma Sputtering Coater System -VTC600GD4HD
The VTC-600GD-4HD High Vacuum Magnetron Sputtering System coating device designed for the deposition of single-layer films. It can be configured with up to four sputtering targets, and also can be equipped with an RF power supply for sputtering non-conductive target materials, or a DC power supply for sputtering conductive materials. It offers broader application capabilities, small footprint as well as a compact and user-friendly design, making it an ideal tool for laboratory thin film deposition. It is especially suitable for research on solid-state electrolytes, OLEDs, and other advanced materials. 3 RF heads model is available.
Highlights:
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Modular System Design: The system adopts a modular structure with separate vacuum chamber, pumping unit, and control power supplies, allowing flexible configuration based on user requirements.
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Flexible Power Configuration: Users can choose from various power supply setupsâone power supply can control multiple sputtering targets, or each target can be independently controlled by a dedicated power supply.
SPECIFICATIONS
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Power Requirements
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Total Power Consumption
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| Source Power |
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Magnetron Sputtering Head |
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Gas Flow Control |
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Vacuum Pump Station (Optional) |
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Water Chiller (Optional) |
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| Film Thickness Measurement (Optional ) |
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 Application Notes |
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Original: $125,985.00
-65%$125,985.00
$44,094.75More Images



DC/RF 4-Head 2" High Vacuum Magnetron Plasma Sputtering Coater System -VTC600GD4HD
The VTC-600GD-4HD High Vacuum Magnetron Sputtering System coating device designed for the deposition of single-layer films. It can be configured with up to four sputtering targets, and also can be equipped with an RF power supply for sputtering non-conductive target materials, or a DC power supply for sputtering conductive materials. It offers broader application capabilities, small footprint as well as a compact and user-friendly design, making it an ideal tool for laboratory thin film deposition. It is especially suitable for research on solid-state electrolytes, OLEDs, and other advanced materials. 3 RF heads model is available.
Highlights:
-
Modular System Design: The system adopts a modular structure with separate vacuum chamber, pumping unit, and control power supplies, allowing flexible configuration based on user requirements.
-
Flexible Power Configuration: Users can choose from various power supply setupsâone power supply can control multiple sputtering targets, or each target can be independently controlled by a dedicated power supply.
SPECIFICATIONS
|
Power Requirements
|
|
|||
|
Total Power Consumption
|
|
|||
| Source Power |
|
|||
|
Magnetron Sputtering Head |
|
|||
|
|
|
|||
|
|
|
|||
|
Gas Flow Control |
|
|||
|
Vacuum Pump Station (Optional) |
|
|||
|
Water Chiller (Optional) |
|
|||
| Film Thickness Measurement (Optional ) |
|
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|
 Application Notes |
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Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
The VTC-600GD-4HD High Vacuum Magnetron Sputtering System coating device designed for the deposition of single-layer films. It can be configured with up to four sputtering targets, and also can be equipped with an RF power supply for sputtering non-conductive target materials, or a DC power supply for sputtering conductive materials. It offers broader application capabilities, small footprint as well as a compact and user-friendly design, making it an ideal tool for laboratory thin film deposition. It is especially suitable for research on solid-state electrolytes, OLEDs, and other advanced materials. 3 RF heads model is available.
Highlights:
-
Modular System Design: The system adopts a modular structure with separate vacuum chamber, pumping unit, and control power supplies, allowing flexible configuration based on user requirements.
-
Flexible Power Configuration: Users can choose from various power supply setupsâone power supply can control multiple sputtering targets, or each target can be independently controlled by a dedicated power supply.
SPECIFICATIONS
|
Power Requirements
|
|
|||
|
Total Power Consumption
|
|
|||
| Source Power |
|
|||
|
Magnetron Sputtering Head |
|
|||
|
|
|
|||
|
|
|
|||
|
Gas Flow Control |
|
|||
|
Vacuum Pump Station (Optional) |
|
|||
|
Water Chiller (Optional) |
|
|||
| Film Thickness Measurement (Optional ) |
|
|||
|
 Application Notes |
|



























