
DC/RF 3-head High Vacuum 2” Magnetron Plasma Sputtering Coater - VTC-600-3HD-LD
VTC-600-3HD-LD is a combinatorial plasma sputtering system with three 2“ magnetron sputtering sources and three RF/DC power supplies. Such a sputtering system is capable of co-sputtering up to three different target materials and creates various composition profiles across the substrate (e.g. ternary materials for Li-ion rechargeable battery). This system is also suitable for sequential coating of multiple layer films such as ferroelectric, alloy, semiconductor, ceramic, dielectric, optical, oxide, hard, PTFE, etc.
SPECIFICATIONS
| Power |
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| Sputtering Power Sources |
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Magnetron Sputtering Head |
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Gas Flow Control |
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Vacuum Pump Station (Optional) |
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Water Chiller (Optional) |
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Film Thickness Measurement (Optional) |
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Compliance |
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Application Note |
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DC/RF 3-head High Vacuum 2” Magnetron Plasma Sputtering Coater - VTC-600-3HD-LD
VTC-600-3HD-LD is a combinatorial plasma sputtering system with three 2“ magnetron sputtering sources and three RF/DC power supplies. Such a sputtering system is capable of co-sputtering up to three different target materials and creates various composition profiles across the substrate (e.g. ternary materials for Li-ion rechargeable battery). This system is also suitable for sequential coating of multiple layer films such as ferroelectric, alloy, semiconductor, ceramic, dielectric, optical, oxide, hard, PTFE, etc.
SPECIFICATIONS
| Power |
|
| Sputtering Power Sources |
|
|
Magnetron Sputtering Head |
|
|
|
|
|
|
|
|
Gas Flow Control |
|
|
Vacuum Pump Station (Optional) |
|
|
Water Chiller (Optional) |
|
|
Film Thickness Measurement (Optional) |
|
|
Compliance |
|
|
Application Note |
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
VTC-600-3HD-LD is a combinatorial plasma sputtering system with three 2“ magnetron sputtering sources and three RF/DC power supplies. Such a sputtering system is capable of co-sputtering up to three different target materials and creates various composition profiles across the substrate (e.g. ternary materials for Li-ion rechargeable battery). This system is also suitable for sequential coating of multiple layer films such as ferroelectric, alloy, semiconductor, ceramic, dielectric, optical, oxide, hard, PTFE, etc.
SPECIFICATIONS
| Power |
|
| Sputtering Power Sources |
|
|
Magnetron Sputtering Head |
|
|
|
|
|
|
|
|
Gas Flow Control |
|
|
Vacuum Pump Station (Optional) |
|
|
Water Chiller (Optional) |
|
|
Film Thickness Measurement (Optional) |
|
|
Compliance |
|
|
Application Note |


























