
Al2O3 - Sapphire Wafer 10x10x0.1 mm A plane (11-20), 2 SP
Features:
-
Sapphire substrate is the popular substrates for III-V nitrides, superconductor and magnetic epi film due to less mis-matched lattice and stable chemical and physical properties
-
Wafer size: 10 mm x 10 mm x 0.1 mm thick
-
Orientation tolerance: +/-0.5 o. A plane orientation
-
Polished surface: substrate surface is EPI polished via a special CMP procedure with RA < 5 A
-
2 sides polished
-
Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with wafer container
-
Precaution: R plane sapphire wafer is easy to cleave compared with C plane's. Please handle it with a care
Typical Properties:
-
Crystal Structure: Hexagonal. a=4.758 Angstroms c=12.99 Angstroms
-
Melting Point: 2040 degree C
-
Density: 3.97 gram/cm2
-
Growth Technique: CZ
-
Crystal Purity: >99.99%
-
Hardness: 9 (mohs)
-
Thermal Expansion: 7.5x10-6 (/oC)
-
Thermal Conductivity: 46.06 @ 0 oC, 25.12 @ 100 oC, 12.56 @ 400 oC ( W/(m.K) )
-
Dielectric Constant: ~ 9.4 @ 300K at A axis, ~ 11.58 @ 300K at C axis
-
Loss Tangent at 10 GHz: < 2x10-5 at A axis , < 5 x10-5 at C axis
Please click here for detail data
Please Click link below to find other substrates for III-V Nitride
| ZnO | SiC | GaN | MgAl2O4 (spinel) | LiGaO2 |
| Other Al2O3 | AlN template | Wafer Carriers | Plasma Cleaners | Film Coater |
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Original: $79.00
-65%$79.00
$27.65Al2O3 - Sapphire Wafer 10x10x0.1 mm A plane (11-20), 2 SP
Features:
-
Sapphire substrate is the popular substrates for III-V nitrides, superconductor and magnetic epi film due to less mis-matched lattice and stable chemical and physical properties
-
Wafer size: 10 mm x 10 mm x 0.1 mm thick
-
Orientation tolerance: +/-0.5 o. A plane orientation
-
Polished surface: substrate surface is EPI polished via a special CMP procedure with RA < 5 A
-
2 sides polished
-
Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with wafer container
-
Precaution: R plane sapphire wafer is easy to cleave compared with C plane's. Please handle it with a care
Typical Properties:
-
Crystal Structure: Hexagonal. a=4.758 Angstroms c=12.99 Angstroms
-
Melting Point: 2040 degree C
-
Density: 3.97 gram/cm2
-
Growth Technique: CZ
-
Crystal Purity: >99.99%
-
Hardness: 9 (mohs)
-
Thermal Expansion: 7.5x10-6 (/oC)
-
Thermal Conductivity: 46.06 @ 0 oC, 25.12 @ 100 oC, 12.56 @ 400 oC ( W/(m.K) )
-
Dielectric Constant: ~ 9.4 @ 300K at A axis, ~ 11.58 @ 300K at C axis
-
Loss Tangent at 10 GHz: < 2x10-5 at A axis , < 5 x10-5 at C axis
Please click here for detail data
Please Click link below to find other substrates for III-V Nitride
| ZnO | SiC | GaN | MgAl2O4 (spinel) | LiGaO2 |
| Other Al2O3 | AlN template | Wafer Carriers | Plasma Cleaners | Film Coater |
![]() |
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
Features:
-
Sapphire substrate is the popular substrates for III-V nitrides, superconductor and magnetic epi film due to less mis-matched lattice and stable chemical and physical properties
-
Wafer size: 10 mm x 10 mm x 0.1 mm thick
-
Orientation tolerance: +/-0.5 o. A plane orientation
-
Polished surface: substrate surface is EPI polished via a special CMP procedure with RA < 5 A
-
2 sides polished
-
Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with wafer container
-
Precaution: R plane sapphire wafer is easy to cleave compared with C plane's. Please handle it with a care
Typical Properties:
-
Crystal Structure: Hexagonal. a=4.758 Angstroms c=12.99 Angstroms
-
Melting Point: 2040 degree C
-
Density: 3.97 gram/cm2
-
Growth Technique: CZ
-
Crystal Purity: >99.99%
-
Hardness: 9 (mohs)
-
Thermal Expansion: 7.5x10-6 (/oC)
-
Thermal Conductivity: 46.06 @ 0 oC, 25.12 @ 100 oC, 12.56 @ 400 oC ( W/(m.K) )
-
Dielectric Constant: ~ 9.4 @ 300K at A axis, ~ 11.58 @ 300K at C axis
-
Loss Tangent at 10 GHz: < 2x10-5 at A axis , < 5 x10-5 at C axis
Please click here for detail data
Please Click link below to find other substrates for III-V Nitride
| ZnO | SiC | GaN | MgAl2O4 (spinel) | LiGaO2 |
| Other Al2O3 | AlN template | Wafer Carriers | Plasma Cleaners | Film Coater |
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