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20" Precision Grinding and Polishing machine with Three Work Stations Up to 8" - UNIPOL- 2001
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20" Precision Grinding and Polishing machine with Three Work Stations Up to 8" - UNIPOL- 2001

20" Precision Grinding and Polishing machine with Three Work Stations Up to 8" - UNIPOL- 2001

UNIPOL- 2001 is a precision grinding and polishing machine with three processing stations, specifically for large-size samples. (≤Ø160mm wafers or rectangular with diagonal length ≤160mm). It can be used for grinding and polishing crystals, ceramics, metals, glass, rock samples, mineral samples, PCB plates, infrared optical materials (such as zinc selenide, zinc sulfide, silicon, germanium, etc.), refractories, composites, and other materials.


SPECIFICATIONS

Environment Condition

Altitude: ≤1000m
Temperature: 25°C±15°C
Humidity: 55%Rh±10%Rh

Power

AC 220V, single phase, 50/60 Hz
 
1.7kW

Grinding Plate and Rocking York

  • One cast-iron plate for lapping and one cast aluminum plate for polishing
    • Diameter Ø508mm (20 inches)
    • Speed: 20-90 RPM
  • Three rocking workstations with wafer holders and condition rings, which can be controlled independently for polishing Three pieced of 6"-  8" wafers at the same time
  • Three flat sample holder and conditional rings  for 6" wafers are included 
  •  8" sample holder and conditional rings are available upon request
Sample Plate Diameter Ø160mm (6 inches)
Thickness: 35mm
*Three sample plates and three plate holders are located at three equal points outside the grinding plate
Conditioning Ring OD: Ø196mm
ID: Ø160.5mm
Thickness 35mm
 Optional Slurry Feeders Please click the pictures below to choose the slurry feeder:
  
Dimensions 1180 L x 820 W x 945 H (mm)
Weight 450kg
Reference Video
Warranty One year limited with lifetime support
Rusting and damage due to improper storage condition or maintenance is not covered by warranty
Reference Video
$9,094.75

Original: $25,985.00

-65%
20" Precision Grinding and Polishing machine with Three Work Stations Up to 8" - UNIPOL- 2001

$25,985.00

$9,094.75

More Images

20" Precision Grinding and Polishing machine with Three Work Stations Up to 8" - UNIPOL- 2001 - Image 2
20" Precision Grinding and Polishing machine with Three Work Stations Up to 8" - UNIPOL- 2001 - Image 3

20" Precision Grinding and Polishing machine with Three Work Stations Up to 8" - UNIPOL- 2001

UNIPOL- 2001 is a precision grinding and polishing machine with three processing stations, specifically for large-size samples. (≤Ø160mm wafers or rectangular with diagonal length ≤160mm). It can be used for grinding and polishing crystals, ceramics, metals, glass, rock samples, mineral samples, PCB plates, infrared optical materials (such as zinc selenide, zinc sulfide, silicon, germanium, etc.), refractories, composites, and other materials.


SPECIFICATIONS

Environment Condition

Altitude: ≤1000m
Temperature: 25°C±15°C
Humidity: 55%Rh±10%Rh

Power

AC 220V, single phase, 50/60 Hz
 
1.7kW

Grinding Plate and Rocking York

  • One cast-iron plate for lapping and one cast aluminum plate for polishing
    • Diameter Ø508mm (20 inches)
    • Speed: 20-90 RPM
  • Three rocking workstations with wafer holders and condition rings, which can be controlled independently for polishing Three pieced of 6"-  8" wafers at the same time
  • Three flat sample holder and conditional rings  for 6" wafers are included 
  •  8" sample holder and conditional rings are available upon request
Sample Plate Diameter Ø160mm (6 inches)
Thickness: 35mm
*Three sample plates and three plate holders are located at three equal points outside the grinding plate
Conditioning Ring OD: Ø196mm
ID: Ø160.5mm
Thickness 35mm
 Optional Slurry Feeders Please click the pictures below to choose the slurry feeder:
  
Dimensions 1180 L x 820 W x 945 H (mm)
Weight 450kg
Reference Video
Warranty One year limited with lifetime support
Rusting and damage due to improper storage condition or maintenance is not covered by warranty
Reference Video

Product Information

Shipping & Returns

Description

UNIPOL- 2001 is a precision grinding and polishing machine with three processing stations, specifically for large-size samples. (≤Ø160mm wafers or rectangular with diagonal length ≤160mm). It can be used for grinding and polishing crystals, ceramics, metals, glass, rock samples, mineral samples, PCB plates, infrared optical materials (such as zinc selenide, zinc sulfide, silicon, germanium, etc.), refractories, composites, and other materials.


SPECIFICATIONS

Environment Condition

Altitude: ≤1000m
Temperature: 25°C±15°C
Humidity: 55%Rh±10%Rh

Power

AC 220V, single phase, 50/60 Hz
 
1.7kW

Grinding Plate and Rocking York

  • One cast-iron plate for lapping and one cast aluminum plate for polishing
    • Diameter Ø508mm (20 inches)
    • Speed: 20-90 RPM
  • Three rocking workstations with wafer holders and condition rings, which can be controlled independently for polishing Three pieced of 6"-  8" wafers at the same time
  • Three flat sample holder and conditional rings  for 6" wafers are included 
  •  8" sample holder and conditional rings are available upon request
Sample Plate Diameter Ø160mm (6 inches)
Thickness: 35mm
*Three sample plates and three plate holders are located at three equal points outside the grinding plate
Conditioning Ring OD: Ø196mm
ID: Ø160.5mm
Thickness 35mm
 Optional Slurry Feeders Please click the pictures below to choose the slurry feeder:
  
Dimensions 1180 L x 820 W x 945 H (mm)
Weight 450kg
Reference Video
Warranty One year limited with lifetime support
Rusting and damage due to improper storage condition or maintenance is not covered by warranty
Reference Video

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