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YSZ (110) with 2 degree miscut toward <100>/<110> 10x10x0.5mm, 1SP - YSZe101005S1deg2
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YSZ (110) with 2 degree miscut toward <100>/<110> 10x10x0.5mm, 1SP - YSZe101005S1deg2

YSZ (110) with 2 degree miscut toward <100>/<110> 10x10x0.5mm, 1SP - YSZe101005S1deg2

Specifications:
  • Single crystal:        YSZ 
  • Size:                     10 x10 x 0.5 mm +/-0.05 mm
  • Orientation:            (110) with 2 degree miscut toward <100>/<110>
  • Polish:                   one side polished, polished by CMP technology
  • Surface roughness: < 5A RMS by AFM
Typical Properties

Chemical Formula

Y2O3 stabilized ZrO2, 8 % mole Y2O3

Crystal Structure

Cubic, Face Centered, CaF2 type

Unit Cell

a = 5.125 A

Density

5.8 g / cc

Melting Point

2500 oC

Thermal Expansion Coeff. 

10.3 ppm / oC

Dielectric Constant

27

Crystal Growth Technique

Flux Technique



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$73.15

Original: $209.00

-65%
YSZ (110) with 2 degree miscut toward <100>/<110> 10x10x0.5mm, 1SP - YSZe101005S1deg2—

$209.00

$73.15

YSZ (110) with 2 degree miscut toward <100>/<110> 10x10x0.5mm, 1SP - YSZe101005S1deg2

Specifications:
  • Single crystal:        YSZ 
  • Size:                     10 x10 x 0.5 mm +/-0.05 mm
  • Orientation:            (110) with 2 degree miscut toward <100>/<110>
  • Polish:                   one side polished, polished by CMP technology
  • Surface roughness: < 5A RMS by AFM
Typical Properties

Chemical Formula

Y2O3 stabilized ZrO2, 8 % mole Y2O3

Crystal Structure

Cubic, Face Centered, CaF2 type

Unit Cell

a = 5.125 A

Density

5.8 g / cc

Melting Point

2500 oC

Thermal Expansion Coeff. 

10.3 ppm / oC

Dielectric Constant

27

Crystal Growth Technique

Flux Technique



Related Products

Other Crystal Wafer A-Z

Plasma Cleaner

 Wafer Containers

Dicing Saw

Film Coater

 

Product Information

Shipping & Returns

Description

Specifications:
  • Single crystal:        YSZ 
  • Size:                     10 x10 x 0.5 mm +/-0.05 mm
  • Orientation:            (110) with 2 degree miscut toward <100>/<110>
  • Polish:                   one side polished, polished by CMP technology
  • Surface roughness: < 5A RMS by AFM
Typical Properties

Chemical Formula

Y2O3 stabilized ZrO2, 8 % mole Y2O3

Crystal Structure

Cubic, Face Centered, CaF2 type

Unit Cell

a = 5.125 A

Density

5.8 g / cc

Melting Point

2500 oC

Thermal Expansion Coeff. 

10.3 ppm / oC

Dielectric Constant

27

Crystal Growth Technique

Flux Technique



Related Products

Other Crystal Wafer A-Z

Plasma Cleaner

 Wafer Containers

Dicing Saw

Film Coater