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SiO2+Ti+Pt thin film on Si substrate ,10x5x0.5mm,1sp,B-doped,( SiO2=500nm,Ti=50nm ,Pt=200nm)
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SiO2+Ti+Pt thin film on Si substrate ,10x5x0.5mm,1sp,B-doped,( SiO2=500nm,Ti=50nm ,Pt=200nm)

SiO2+Ti+Pt thin film on Si substrate ,10x5x0.5mm,1sp,B-doped,( SiO2=500nm,Ti=50nm ,Pt=200nm)


Silicon Wafer Specifications:

  • Conductive type:        SiO2+Ti+Pt thin film on Si(B-doped) substrate ,10x5x0.5mm,1sp( SiO2=500nm,Ti=50nm  ,Pt=200nm)
  • Resistivity:                  <0.005 ohm.cm 
  • Size:                          10x5 x 0.5 mm
  • Polish:                        one side polished
  • Surface roughness:    < 5A, RMS



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$24.15

Original: $69.00

-65%
SiO2+Ti+Pt thin film on Si substrate ,10x5x0.5mm,1sp,B-doped,( SiO2=500nm,Ti=50nm ,Pt=200nm)

$69.00

$24.15

SiO2+Ti+Pt thin film on Si substrate ,10x5x0.5mm,1sp,B-doped,( SiO2=500nm,Ti=50nm ,Pt=200nm)


Silicon Wafer Specifications:

  • Conductive type:        SiO2+Ti+Pt thin film on Si(B-doped) substrate ,10x5x0.5mm,1sp( SiO2=500nm,Ti=50nm  ,Pt=200nm)
  • Resistivity:                  <0.005 ohm.cm 
  • Size:                          10x5 x 0.5 mm
  • Polish:                        one side polished
  • Surface roughness:    < 5A, RMS



Related Products

Thin Films  A-Z

Crystal wafer A-Z

Plasma Cleaner

Wafer Containers

Dicing saw

Film Coater

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Description


Silicon Wafer Specifications:

  • Conductive type:        SiO2+Ti+Pt thin film on Si(B-doped) substrate ,10x5x0.5mm,1sp( SiO2=500nm,Ti=50nm  ,Pt=200nm)
  • Resistivity:                  <0.005 ohm.cm 
  • Size:                          10x5 x 0.5 mm
  • Polish:                        one side polished
  • Surface roughness:    < 5A, RMS



Related Products

Thin Films  A-Z

Crystal wafer A-Z

Plasma Cleaner

Wafer Containers

Dicing saw

Film Coater

SiO2+Ti+Pt thin film on Si substrate ,10x5x0.5mm,1sp,B-doped,( SiO2=500nm,Ti=50nm ,Pt=200nm) | MTI Online Store