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SiC - 6H (0001) 8mm dia. x 0.3 mm th., one side polished
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SiC - 6H (0001) 8mm dia. x 0.3 mm th., one side polished

SiC - 6H (0001) 8mm dia. x 0.3 mm th., one side polished

Specifications of Substrate

  • Orientation:  <0001> +/-0.5
  • Dimension: 8mm Dia.x 0.3mm
  • Polished:  One side  epi polished
  • Surface Roughness:  < 10 A by AFM

Typical Properties of Single Crystal SiC

  • Formula weight:  40.10
  • Unit Cell: Hexagonal
  • Lattice constant: a =3.08 A       c = 15.117 A
  • Stacking sequence: ABCACB  (6H)
  • Growth Technique:  MOCVD         
  • Polishing: Silicon face polished
  • Band Gap: 3.03eV ( Indirect)
  • Conductivity type: N
  • TTV/Bow/Warp:<25um
  • Micropipe Density:  <30 cm^-2
  • Resistivity:  0.020~0.200 ohm-cm
  • Dielectric Constant: e (11) = e (22) = 9.66    e (33) = 10.33
  • Thermal Conductivity @ 300K: 5 W / cm . K
  • Hardness: 9 Mohs

Related Product

Other SiC

GaN

 AlN template 

ZnO

Sapphire

Dicing Saw

Wafer Containers

Film Coater

A-plane (11-20)


 

 

 

 

$189.00
SiC - 6H (0001) 8mm dia. x 0.3 mm th., one side polished
$189.00

SiC - 6H (0001) 8mm dia. x 0.3 mm th., one side polished

Specifications of Substrate

  • Orientation:  <0001> +/-0.5
  • Dimension: 8mm Dia.x 0.3mm
  • Polished:  One side  epi polished
  • Surface Roughness:  < 10 A by AFM

Typical Properties of Single Crystal SiC

  • Formula weight:  40.10
  • Unit Cell: Hexagonal
  • Lattice constant: a =3.08 A       c = 15.117 A
  • Stacking sequence: ABCACB  (6H)
  • Growth Technique:  MOCVD         
  • Polishing: Silicon face polished
  • Band Gap: 3.03eV ( Indirect)
  • Conductivity type: N
  • TTV/Bow/Warp:<25um
  • Micropipe Density:  <30 cm^-2
  • Resistivity:  0.020~0.200 ohm-cm
  • Dielectric Constant: e (11) = e (22) = 9.66    e (33) = 10.33
  • Thermal Conductivity @ 300K: 5 W / cm . K
  • Hardness: 9 Mohs

Related Product

Other SiC

GaN

 AlN template 

ZnO

Sapphire

Dicing Saw

Wafer Containers

Film Coater

A-plane (11-20)


 

 

 

 

Product Information

Shipping & Returns

Description

Specifications of Substrate

  • Orientation:  <0001> +/-0.5
  • Dimension: 8mm Dia.x 0.3mm
  • Polished:  One side  epi polished
  • Surface Roughness:  < 10 A by AFM

Typical Properties of Single Crystal SiC

  • Formula weight:  40.10
  • Unit Cell: Hexagonal
  • Lattice constant: a =3.08 A       c = 15.117 A
  • Stacking sequence: ABCACB  (6H)
  • Growth Technique:  MOCVD         
  • Polishing: Silicon face polished
  • Band Gap: 3.03eV ( Indirect)
  • Conductivity type: N
  • TTV/Bow/Warp:<25um
  • Micropipe Density:  <30 cm^-2
  • Resistivity:  0.020~0.200 ohm-cm
  • Dielectric Constant: e (11) = e (22) = 9.66    e (33) = 10.33
  • Thermal Conductivity @ 300K: 5 W / cm . K
  • Hardness: 9 Mohs

Related Product

Other SiC

GaN

 AlN template 

ZnO

Sapphire

Dicing Saw

Wafer Containers

Film Coater

A-plane (11-20)


 

 

 

 

SiC - 6H (0001) 8mm dia. x 0.3 mm th., one side polished | MTI Online Store