
SiC - 6H (0001), 5x5x0.33 mm, 2 SP
Specifications of Substrate
- Orientation: <0001> +/-0.5
- Dimension: 5x5x0.33 +/-0.025 mm
- Polished: two sides epi polished
- Surface Roughness: < 10 A by AFM
Typical Properties of Single Crystal SiC
- Formula weight: 40.10
- Unit Cell: Hexagonal
- Lattice constant: a =3.08 A, c = 15.117 A
- Stacking sequence: ABCACB (6H)
- Growth Technique: MOCVD
- Polishing: Silicon face polished
- Band Gap: 3.03eV ( Indirect)
- Conductivity type: N
- TTV/Bow/Warp: <25 um
- Micropipe Density: <30 cm^-2
- Resistivity: 0.02~0.2 ohm-cm
- Dielectric Constant: e (11) = e (22) = 9.66, e (33) = 10.33
- Thermal Conductivity @ 300K: 5 W / cm . K
- Hardness: 9 Mohs
- TTV/Bow/Warp: <25 um
- Micropipe Density: <30 cm^-2
Related Product
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GaN |
AlN template |
ZnO |
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Dicing Saw |
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SiC - 6H (0001), 5x5x0.33 mm, 2 SP
Specifications of Substrate
- Orientation: <0001> +/-0.5
- Dimension: 5x5x0.33 +/-0.025 mm
- Polished: two sides epi polished
- Surface Roughness: < 10 A by AFM
Typical Properties of Single Crystal SiC
- Formula weight: 40.10
- Unit Cell: Hexagonal
- Lattice constant: a =3.08 A, c = 15.117 A
- Stacking sequence: ABCACB (6H)
- Growth Technique: MOCVD
- Polishing: Silicon face polished
- Band Gap: 3.03eV ( Indirect)
- Conductivity type: N
- TTV/Bow/Warp: <25 um
- Micropipe Density: <30 cm^-2
- Resistivity: 0.02~0.2 ohm-cm
- Dielectric Constant: e (11) = e (22) = 9.66, e (33) = 10.33
- Thermal Conductivity @ 300K: 5 W / cm . K
- Hardness: 9 Mohs
- TTV/Bow/Warp: <25 um
- Micropipe Density: <30 cm^-2
Related Product
Other SiC |
GaN |
AlN template |
ZnO |
|
|
||
Sapphire |
Dicing Saw |
Wafer Containers |
Film Coater |
|
|
Product Information
Product Information
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Description
Specifications of Substrate
- Orientation: <0001> +/-0.5
- Dimension: 5x5x0.33 +/-0.025 mm
- Polished: two sides epi polished
- Surface Roughness: < 10 A by AFM
Typical Properties of Single Crystal SiC
- Formula weight: 40.10
- Unit Cell: Hexagonal
- Lattice constant: a =3.08 A, c = 15.117 A
- Stacking sequence: ABCACB (6H)
- Growth Technique: MOCVD
- Polishing: Silicon face polished
- Band Gap: 3.03eV ( Indirect)
- Conductivity type: N
- TTV/Bow/Warp: <25 um
- Micropipe Density: <30 cm^-2
- Resistivity: 0.02~0.2 ohm-cm
- Dielectric Constant: e (11) = e (22) = 9.66, e (33) = 10.33
- Thermal Conductivity @ 300K: 5 W / cm . K
- Hardness: 9 Mohs
- TTV/Bow/Warp: <25 um
- Micropipe Density: <30 cm^-2
Related Product
Other SiC |
GaN |
AlN template |
ZnO |
|
|
||
Sapphire |
Dicing Saw |
Wafer Containers |
Film Coater |
|
|










