🚚 Free Worldwide Shipping on All Orders!Shop Now
SiC - 6H (0001), 1/4"x1/4"x0.26 mm , two sides polished
HomeStore

SiC - 6H (0001), 1/4"x1/4"x0.26 mm , two sides polished

SiC - 6H (0001), 1/4"x1/4"x0.26 mm , two sides polished

Specifications of Substrate

  • Orientation:  <0001> +/-0.5
  • Dimension:   1/4"x 1/4" x 0.26  +/-0.03 mm
  • Polished:  Two sides epi polished
  • Surface Roughness:  < 10 A by AFM

Typical Properties of Single Crystal SiC

  • Formula weight:  40.10
  • Unit Cell: Hexagonal
  • Lattice constant:  a =3.08 A       c = 15.117 A
  • Stacking sequence: ABCACB  (6H)
  • Growth Technique:  MOCVD         
  • Polishing : Silicon face polished
  •  Band Gap: 3.03 eV ( Indirect)
  • Conductivity type:  N
  • TTV/Bow/Warp:<25 um
  • Micropipe Density:  <30 cm^-2
  • Resistivity: 0.02~0.2 ohm-cm
  • Dielectric Constant: e (11) = e (22) = 9.66    e (33) = 10.33
  • Thermal Conductivity @ 300K: 4 W / cm . K
  • Hardness: 9 Mohs

Related Product

Other SiC

GaN

 AlN template 

ZnO

Sapphire

Dicing Saw

Wafer Containers

Film Coater

A-plane (11-20)



 

 

 

$27.65

Original: $79.00

-65%
SiC - 6H (0001), 1/4"x1/4"x0.26 mm , two sides polished

$79.00

$27.65

SiC - 6H (0001), 1/4"x1/4"x0.26 mm , two sides polished

Specifications of Substrate

  • Orientation:  <0001> +/-0.5
  • Dimension:   1/4"x 1/4" x 0.26  +/-0.03 mm
  • Polished:  Two sides epi polished
  • Surface Roughness:  < 10 A by AFM

Typical Properties of Single Crystal SiC

  • Formula weight:  40.10
  • Unit Cell: Hexagonal
  • Lattice constant:  a =3.08 A       c = 15.117 A
  • Stacking sequence: ABCACB  (6H)
  • Growth Technique:  MOCVD         
  • Polishing : Silicon face polished
  •  Band Gap: 3.03 eV ( Indirect)
  • Conductivity type:  N
  • TTV/Bow/Warp:<25 um
  • Micropipe Density:  <30 cm^-2
  • Resistivity: 0.02~0.2 ohm-cm
  • Dielectric Constant: e (11) = e (22) = 9.66    e (33) = 10.33
  • Thermal Conductivity @ 300K: 4 W / cm . K
  • Hardness: 9 Mohs

Related Product

Other SiC

GaN

 AlN template 

ZnO

Sapphire

Dicing Saw

Wafer Containers

Film Coater

A-plane (11-20)



 

 

 

Product Information

Shipping & Returns

Description

Specifications of Substrate

  • Orientation:  <0001> +/-0.5
  • Dimension:   1/4"x 1/4" x 0.26  +/-0.03 mm
  • Polished:  Two sides epi polished
  • Surface Roughness:  < 10 A by AFM

Typical Properties of Single Crystal SiC

  • Formula weight:  40.10
  • Unit Cell: Hexagonal
  • Lattice constant:  a =3.08 A       c = 15.117 A
  • Stacking sequence: ABCACB  (6H)
  • Growth Technique:  MOCVD         
  • Polishing : Silicon face polished
  •  Band Gap: 3.03 eV ( Indirect)
  • Conductivity type:  N
  • TTV/Bow/Warp:<25 um
  • Micropipe Density:  <30 cm^-2
  • Resistivity: 0.02~0.2 ohm-cm
  • Dielectric Constant: e (11) = e (22) = 9.66    e (33) = 10.33
  • Thermal Conductivity @ 300K: 4 W / cm . K
  • Hardness: 9 Mohs

Related Product

Other SiC

GaN

 AlN template 

ZnO

Sapphire

Dicing Saw

Wafer Containers

Film Coater

A-plane (11-20)



 

 

 

SiC - 6H (0001), 1/4"x1/4"x0.26 mm , two sides polished | MTI Online Store