🚚 Free Worldwide Shipping on All Orders!Shop Now
SiC - 4H (0001), 5x5x0.3 mm , one side polished  ( C side)
HomeStore

SiC - 4H (0001), 5x5x0.3 mm , one side polished ( C side)

SiC - 4H (0001), 5x5x0.3 mm , one side polished ( C side)

Specifications of Substrate

  • Orientation:  <0001> +/-0.5
  • Dimension:  5x5 x 0.3  +/-0.03 mm
  • Polished:  One sides epi polished on C face
  • Surface Roughness: < 10 A by AFM

Typical Properties of Single Crystal SiC

  • Formula weight:   40.10
  • Unit Cell: Hexagonal
  • Lattice constant: a =3.07 A       c = 10.05 A
  • Stacking sequence: ABCB  (4H)
  • Growth Technique: MOCVD         
  • Polishing : Silicon face polished
  •  Band Gap:  3.26 eV ( Indirect)
  • Conductivity type: N
  • TTV/Bow/Warp: <=35um
  • Micropipe Density:  <=30 cm^-2
  • Resistivity:  0.01~0.5 ohm-cm
  • Dielectric Constant: e (11) = e (22) = 9.66     e (33) = 10.33
  • Thermal Conductivity @ 300K:   4 W / cm . K
  • Hardness:   9 Mohs
  • Doping level of nitrogen atoms : 10^18-19 cm^-3

Related Product

Other SiC

GaN

 AlN template 

ZnO

Sapphire

Dicing Saw

Wafer Containers

Film Coater

A-plane (11-20)

$12.58

Original: $35.95

-65%
SiC - 4H (0001), 5x5x0.3 mm , one side polished ( C side)

$35.95

$12.58

SiC - 4H (0001), 5x5x0.3 mm , one side polished ( C side)

Specifications of Substrate

  • Orientation:  <0001> +/-0.5
  • Dimension:  5x5 x 0.3  +/-0.03 mm
  • Polished:  One sides epi polished on C face
  • Surface Roughness: < 10 A by AFM

Typical Properties of Single Crystal SiC

  • Formula weight:   40.10
  • Unit Cell: Hexagonal
  • Lattice constant: a =3.07 A       c = 10.05 A
  • Stacking sequence: ABCB  (4H)
  • Growth Technique: MOCVD         
  • Polishing : Silicon face polished
  •  Band Gap:  3.26 eV ( Indirect)
  • Conductivity type: N
  • TTV/Bow/Warp: <=35um
  • Micropipe Density:  <=30 cm^-2
  • Resistivity:  0.01~0.5 ohm-cm
  • Dielectric Constant: e (11) = e (22) = 9.66     e (33) = 10.33
  • Thermal Conductivity @ 300K:   4 W / cm . K
  • Hardness:   9 Mohs
  • Doping level of nitrogen atoms : 10^18-19 cm^-3

Related Product

Other SiC

GaN

 AlN template 

ZnO

Sapphire

Dicing Saw

Wafer Containers

Film Coater

A-plane (11-20)

Product Information

Shipping & Returns

Description

Specifications of Substrate

  • Orientation:  <0001> +/-0.5
  • Dimension:  5x5 x 0.3  +/-0.03 mm
  • Polished:  One sides epi polished on C face
  • Surface Roughness: < 10 A by AFM

Typical Properties of Single Crystal SiC

  • Formula weight:   40.10
  • Unit Cell: Hexagonal
  • Lattice constant: a =3.07 A       c = 10.05 A
  • Stacking sequence: ABCB  (4H)
  • Growth Technique: MOCVD         
  • Polishing : Silicon face polished
  •  Band Gap:  3.26 eV ( Indirect)
  • Conductivity type: N
  • TTV/Bow/Warp: <=35um
  • Micropipe Density:  <=30 cm^-2
  • Resistivity:  0.01~0.5 ohm-cm
  • Dielectric Constant: e (11) = e (22) = 9.66     e (33) = 10.33
  • Thermal Conductivity @ 300K:   4 W / cm . K
  • Hardness:   9 Mohs
  • Doping level of nitrogen atoms : 10^18-19 cm^-3

Related Product

Other SiC

GaN

 AlN template 

ZnO

Sapphire

Dicing Saw

Wafer Containers

Film Coater

A-plane (11-20)