
Si Wafer (111), 4 " dia x 0.3 mm, N Type P doped, 1SP, Resistivities: 15,000 - 25,000 ohm-cm
Si Wafer (111), 4 " dia x 0.3 mm, N Type P doped, 1SP, Resistivities: 15,000 - 25,000 ohm-cm
- Single Crystal: Si
- Growth Method: FZ (Floating Zone)
- Type/Dopant: N/Phosphorus
- Orientation: (111)
- Resistivity: 15,000 - 25,000 ohm-cm
- Diameter: 100 mm +/- 0.5 mm
- Thickness: 0.3 mm +/- 0.025 mm
- Primary Flat: <110>
- Polish: One side polished
Optional: you may need tool below to handle the wafer ( click picture to order )
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Original: $149.00
-65%$149.00
$52.15Si Wafer (111), 4 " dia x 0.3 mm, N Type P doped, 1SP, Resistivities: 15,000 - 25,000 ohm-cm
- Single Crystal: Si
- Growth Method: FZ (Floating Zone)
- Type/Dopant: N/Phosphorus
- Orientation: (111)
- Resistivity: 15,000 - 25,000 ohm-cm
- Diameter: 100 mm +/- 0.5 mm
- Thickness: 0.3 mm +/- 0.025 mm
- Primary Flat: <110>
- Polish: One side polished
Optional: you may need tool below to handle the wafer ( click picture to order )
Other Crystal wafer A-Z |
Plasma Cleaner |
Wafer Containers |
Dicing saw |
Film Coater |
Product Information
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Description
- Single Crystal: Si
- Growth Method: FZ (Floating Zone)
- Type/Dopant: N/Phosphorus
- Orientation: (111)
- Resistivity: 15,000 - 25,000 ohm-cm
- Diameter: 100 mm +/- 0.5 mm
- Thickness: 0.3 mm +/- 0.025 mm
- Primary Flat: <110>
- Polish: One side polished
Optional: you may need tool below to handle the wafer ( click picture to order )
Other Crystal wafer A-Z |
Plasma Cleaner |
Wafer Containers |
Dicing saw |
Film Coater |










