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SiC - 4H (0001), 10x10x0.30-0.35 mm , Si Face, 1SP - SC4HZ1010035S1
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SiC - 4H (0001), 10x10x0.30-0.35 mm , Si Face, 1SP - SC4HZ1010035S1

SiC - 4H (0001), 10x10x0.30-0.35 mm , Si Face, 1SP - SC4HZ1010035S1

Specifications of Substrate

  • Orientation:  <0001> +/-0.5
  • Dimension:  10 x 10 x 0.30-0.35mm
  • Polished:  One sides epi polished on Si face
  • Surface Roughness:  < 10 A by AFM

Typical Properties of Single Crystal SiC

  • Formula weight:   40.10
  • Unit Cell: Hexagonal
  • Lattice constant: a =3.07 A       c = 10.05 A
  • Stacking sequence:  ABCB  (4H)
  • Growth Technique: MOCVD        
  • Polishing : Silicon face polished
  •  Band Gap:  3.26 eV ( Indirect)
  • Conductivity type: N
  • TTV/Bow/Warp: <=35um
  • Micropipe Density:  <=30 cm^-2
  • Resistivity: 0.01~0.5 ohm-cm
  • Dielectric Constant:  e (11) = e (22) = 9.66     e (33) = 10.33
  • Thermal Conductivity @ 300K:  5 W / cm . K
  • Hardness: 9 Mohs
  • Doping level of nitrogen atoms : 10^18-19 cm^-3

Related Product

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GaN

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A-plane (11-20)

$38.15

Original: $109.00

-65%
SiC - 4H (0001), 10x10x0.30-0.35 mm , Si Face, 1SP - SC4HZ1010035S1

$109.00

$38.15

SiC - 4H (0001), 10x10x0.30-0.35 mm , Si Face, 1SP - SC4HZ1010035S1

Specifications of Substrate

  • Orientation:  <0001> +/-0.5
  • Dimension:  10 x 10 x 0.30-0.35mm
  • Polished:  One sides epi polished on Si face
  • Surface Roughness:  < 10 A by AFM

Typical Properties of Single Crystal SiC

  • Formula weight:   40.10
  • Unit Cell: Hexagonal
  • Lattice constant: a =3.07 A       c = 10.05 A
  • Stacking sequence:  ABCB  (4H)
  • Growth Technique: MOCVD        
  • Polishing : Silicon face polished
  •  Band Gap:  3.26 eV ( Indirect)
  • Conductivity type: N
  • TTV/Bow/Warp: <=35um
  • Micropipe Density:  <=30 cm^-2
  • Resistivity: 0.01~0.5 ohm-cm
  • Dielectric Constant:  e (11) = e (22) = 9.66     e (33) = 10.33
  • Thermal Conductivity @ 300K:  5 W / cm . K
  • Hardness: 9 Mohs
  • Doping level of nitrogen atoms : 10^18-19 cm^-3

Related Product

Other SiC

GaN

 AlN template 

ZnO

Sapphire

Dicing Saw

Wafer Containers

Film Coater

A-plane (11-20)

Product Information

Shipping & Returns

Description

Specifications of Substrate

  • Orientation:  <0001> +/-0.5
  • Dimension:  10 x 10 x 0.30-0.35mm
  • Polished:  One sides epi polished on Si face
  • Surface Roughness:  < 10 A by AFM

Typical Properties of Single Crystal SiC

  • Formula weight:   40.10
  • Unit Cell: Hexagonal
  • Lattice constant: a =3.07 A       c = 10.05 A
  • Stacking sequence:  ABCB  (4H)
  • Growth Technique: MOCVD        
  • Polishing : Silicon face polished
  •  Band Gap:  3.26 eV ( Indirect)
  • Conductivity type: N
  • TTV/Bow/Warp: <=35um
  • Micropipe Density:  <=30 cm^-2
  • Resistivity: 0.01~0.5 ohm-cm
  • Dielectric Constant:  e (11) = e (22) = 9.66     e (33) = 10.33
  • Thermal Conductivity @ 300K:  5 W / cm . K
  • Hardness: 9 Mohs
  • Doping level of nitrogen atoms : 10^18-19 cm^-3

Related Product

Other SiC

GaN

 AlN template 

ZnO

Sapphire

Dicing Saw

Wafer Containers

Film Coater

A-plane (11-20)

SiC - 4H (0001), 10x10x0.30-0.35 mm , Si Face, 1SP - SC4HZ1010035S1 | MTI Online Store