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Plastic Foam Module Wafer Carrier for Single 4" Wafer (SP4-12012T/BK)
| Plastic Foam Module Wafer Carrier is a solution for valued and fragile devices. This packing is designed to protect delicate parts during transport, processing, inspection and assembly. Also it has been applied largely in many fields like optical materials, opto-electonic components, semiconductor, and optical communication. The structure consists of three cushions, the middle cushion called module cushion can be customized to specific shape to hold the devices exactly and safely. The inner foam and outer foam are both made with anti-static IXPE Conductive Foam. The top plastic case is made with polycarbonate, while the bottom plastic case is made with ABS. |
|
Specifications TYPE: SP4-12012T/BK |
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$1.63
Original: $4.65
-65%Plastic Foam Module Wafer Carrier for Single 4" Wafer (SP4-12012T/BK)—
$4.65
$1.63Plastic Foam Module Wafer Carrier for Single 4" Wafer (SP4-12012T/BK)
| Plastic Foam Module Wafer Carrier is a solution for valued and fragile devices. This packing is designed to protect delicate parts during transport, processing, inspection and assembly. Also it has been applied largely in many fields like optical materials, opto-electonic components, semiconductor, and optical communication. The structure consists of three cushions, the middle cushion called module cushion can be customized to specific shape to hold the devices exactly and safely. The inner foam and outer foam are both made with anti-static IXPE Conductive Foam. The top plastic case is made with polycarbonate, while the bottom plastic case is made with ABS. |
|
Specifications TYPE: SP4-12012T/BK |
Related Products
|
Round Wafer Carriers
|
Membrane Film Boxes
|
Gel Sticky Boxes
|
IC Tray & Plastic Boxes
|
Ultrasonics Cleaner
|
Vacuum Storage Chambers
|
Cutting / Dicing Saws |
Crystal Substrate A-Z
|
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
| Plastic Foam Module Wafer Carrier is a solution for valued and fragile devices. This packing is designed to protect delicate parts during transport, processing, inspection and assembly. Also it has been applied largely in many fields like optical materials, opto-electonic components, semiconductor, and optical communication. The structure consists of three cushions, the middle cushion called module cushion can be customized to specific shape to hold the devices exactly and safely. The inner foam and outer foam are both made with anti-static IXPE Conductive Foam. The top plastic case is made with polycarbonate, while the bottom plastic case is made with ABS. |
|
Specifications TYPE: SP4-12012T/BK |
Related Products
|
Round Wafer Carriers
|
Membrane Film Boxes
|
Gel Sticky Boxes
|
IC Tray & Plastic Boxes
|
Ultrasonics Cleaner
|
Vacuum Storage Chambers
|
Cutting / Dicing Saws |
Crystal Substrate A-Z
|
