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Nickel <111> Film (100nm) + 300 nm SiO2 coated Silicon Wafer -4" dia .(100) P/Boron ,SSP, R:1-20 ohm.cm
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Nickel <111> Film (100nm) + 300 nm SiO2 coated Silicon Wafer -4" dia .(100) P/Boron ,SSP, R:1-20 ohm.cm

Nickel <111> Film (100nm) + 300 nm SiO2 coated Silicon Wafer -4" dia .(100) P/Boron ,SSP, R:1-20 ohm.cm

Nickel Metallic Film 

  • Nickel Thickness: 100nm
  • Film Crystallinity:   (111) - oriented polycrystals
  • Roughness, RMS:  N/A

Silicon Wafer Specifications:

  • Conductive type:        Si   P- type, B-doped
  • Resistivity:                  1-20  ohm-cm
  • Size:                          4" diameter +/- 0.5 mm  x 0.525 +/- 0.025 mm th
  • Orientation:                (100) +/- 0.5o
  • Polish:                        One  sides  polished
  • Surface roughness:     Prime
  • Packing:                      Vacuum packed on a 4" single wafer carrier
  • Optional:  you may need tool below to handle the wafer ( click picture to order )



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$498.00
Nickel <111> Film (100nm) + 300 nm SiO2 coated Silicon Wafer -4" dia .(100) P/Boron ,SSP, R:1-20 ohm.cm
$498.00

Nickel <111> Film (100nm) + 300 nm SiO2 coated Silicon Wafer -4" dia .(100) P/Boron ,SSP, R:1-20 ohm.cm

Nickel Metallic Film 

  • Nickel Thickness: 100nm
  • Film Crystallinity:   (111) - oriented polycrystals
  • Roughness, RMS:  N/A

Silicon Wafer Specifications:

  • Conductive type:        Si   P- type, B-doped
  • Resistivity:                  1-20  ohm-cm
  • Size:                          4" diameter +/- 0.5 mm  x 0.525 +/- 0.025 mm th
  • Orientation:                (100) +/- 0.5o
  • Polish:                        One  sides  polished
  • Surface roughness:     Prime
  • Packing:                      Vacuum packed on a 4" single wafer carrier
  • Optional:  you may need tool below to handle the wafer ( click picture to order )



Related Products

Thin Films  A-Z

Crystal wafer A-Z

Plasma Cleaner

 Wafer Containers

Dicing saw

Film Coater

Product Information

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Description

Nickel Metallic Film 

  • Nickel Thickness: 100nm
  • Film Crystallinity:   (111) - oriented polycrystals
  • Roughness, RMS:  N/A

Silicon Wafer Specifications:

  • Conductive type:        Si   P- type, B-doped
  • Resistivity:                  1-20  ohm-cm
  • Size:                          4" diameter +/- 0.5 mm  x 0.525 +/- 0.025 mm th
  • Orientation:                (100) +/- 0.5o
  • Polish:                        One  sides  polished
  • Surface roughness:     Prime
  • Packing:                      Vacuum packed on a 4" single wafer carrier
  • Optional:  you may need tool below to handle the wafer ( click picture to order )



Related Products

Thin Films  A-Z

Crystal wafer A-Z

Plasma Cleaner

 Wafer Containers

Dicing saw

Film Coater

Nickel <111> Film (100nm) + 300 nm SiO2 coated Silicon Wafer -4" dia .(100) P/Boron ,SSP, R:1-20 ohm.cm | MTI Online Store