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[KMg3(AlSi3O10)F2] -Synthetized Fluorphlogopite Mica, 8x 8x0.2 thick (mm), as cleaved
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[KMg3(AlSi3O10)F2] -Synthetized Fluorphlogopite Mica, 8x 8x0.2 thick (mm), as cleaved

[KMg3(AlSi3O10)F2] -Synthetized Fluorphlogopite Mica, 8x 8x0.2 thick (mm), as cleaved

 Synthetic fluorophlogopite  is obtained by cooling and devitrification of chemical raw materials by high-temperature melting. The single wafer fraction is KMg3(AlSi3O10)F2, which belongs to the monoclinic system and is a typical layered silicate.
 
 KMg3(AlSi3O10)F2   is a typical layered silicate. Many of its properties are superior to natural mica. For example, when the temperature is higher than 1200°C, the volume resistivity of synthetic fluorophlogopite is 1000 times higher than that of natural mica under high temperature conditions. The electrical insulation is good, and the vacuum is very low at high temperatures. As well as being resistant to acids, alkalis, transparent, separable and flexible, it is an important non-metallic insulating material for modern industries and high-tech industries such as motors, electrical appliances, electronics, and aviation. 

Specifications:
  • [KMg3(AlSi3O10)F2]  -synthetized fluorphlogopite mica
  • Size: 8 mm x 8 mm 
  • Thickness: 0.2 mm
  • Surface Finish: as cleaved
Density 2.78~2.85 * 10^3 kg/m^3
Volume Resitivity 10^15~10^16 Ω·cm
Surface Resitivity 10^11~10^13 Ω
Dielectric Strength 185~236kV/mm
Permittivity 5.6 ε
dielectric loss 1~4x 10^-4 tg δ
Melting Point 1375 ± 5
Max Working Temperature(Tmax) 1100
Thermal Weight Loss (40 ~ 1180 0.85%
Specific heat capacity 836 J/kg · K
Linear Thermal Expansion () 10 ~ 12 x 10^-6/K
(⊥) 15 ~ 25 x 10^-6/K
Thermal conductivity () 3.75W/m·K
(⊥) 0.55W/m·K
optical axial angle 8° ~ 14°
Hardness Mohs Hardness 3~3.4
Microhardness Hv0.2 1.35GPa
S 138~146
refractive index N_p 1.513~1.544
N_m 1.539~1.564
N_g 1.540~1.566
Ultimate tensile strength  150~200MPa
Compressive strength 400~520MPa
Water absorption 0.14~0.23%
Moisture absorption 0~0.05%
Mosaicity < 0.25

Coefficient of Linear Thermal Expansion (x10^-6/K)
Temperature 200 600 900
Cleavage 10.0 6.3 2.96
⊥ Cleavage 21.2 11.5 5.08

Volume Resitivity Under High Temperature (Ω·cm)
Temperature Room temperature 300 500 600 700 800
Volume Resitivity 3.9 x 10^15 5.1 x 10^13 1.6 x 10^13 1.6 x 10^12 5.6x10^11 3.9x10^10

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    $20.65

    Original: $59.00

    -65%
    [KMg3(AlSi3O10)F2] -Synthetized Fluorphlogopite Mica, 8x 8x0.2 thick (mm), as cleaved

    $59.00

    $20.65

    [KMg3(AlSi3O10)F2] -Synthetized Fluorphlogopite Mica, 8x 8x0.2 thick (mm), as cleaved

     Synthetic fluorophlogopite  is obtained by cooling and devitrification of chemical raw materials by high-temperature melting. The single wafer fraction is KMg3(AlSi3O10)F2, which belongs to the monoclinic system and is a typical layered silicate.
     
     KMg3(AlSi3O10)F2   is a typical layered silicate. Many of its properties are superior to natural mica. For example, when the temperature is higher than 1200°C, the volume resistivity of synthetic fluorophlogopite is 1000 times higher than that of natural mica under high temperature conditions. The electrical insulation is good, and the vacuum is very low at high temperatures. As well as being resistant to acids, alkalis, transparent, separable and flexible, it is an important non-metallic insulating material for modern industries and high-tech industries such as motors, electrical appliances, electronics, and aviation. 

    Specifications:
    • [KMg3(AlSi3O10)F2]  -synthetized fluorphlogopite mica
    • Size: 8 mm x 8 mm 
    • Thickness: 0.2 mm
    • Surface Finish: as cleaved
    Density 2.78~2.85 * 10^3 kg/m^3
    Volume Resitivity 10^15~10^16 Ω·cm
    Surface Resitivity 10^11~10^13 Ω
    Dielectric Strength 185~236kV/mm
    Permittivity 5.6 ε
    dielectric loss 1~4x 10^-4 tg δ
    Melting Point 1375 ± 5
    Max Working Temperature(Tmax) 1100
    Thermal Weight Loss (40 ~ 1180 0.85%
    Specific heat capacity 836 J/kg · K
    Linear Thermal Expansion () 10 ~ 12 x 10^-6/K
    (⊥) 15 ~ 25 x 10^-6/K
    Thermal conductivity () 3.75W/m·K
    (⊥) 0.55W/m·K
    optical axial angle 8° ~ 14°
    Hardness Mohs Hardness 3~3.4
    Microhardness Hv0.2 1.35GPa
    S 138~146
    refractive index N_p 1.513~1.544
    N_m 1.539~1.564
    N_g 1.540~1.566
    Ultimate tensile strength  150~200MPa
    Compressive strength 400~520MPa
    Water absorption 0.14~0.23%
    Moisture absorption 0~0.05%
    Mosaicity < 0.25

    Coefficient of Linear Thermal Expansion (x10^-6/K)
    Temperature 200 600 900
    Cleavage 10.0 6.3 2.96
    ⊥ Cleavage 21.2 11.5 5.08

    Volume Resitivity Under High Temperature (Ω·cm)
    Temperature Room temperature 300 500 600 700 800
    Volume Resitivity 3.9 x 10^15 5.1 x 10^13 1.6 x 10^13 1.6 x 10^12 5.6x10^11 3.9x10^10

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      Product Information

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      Description

       Synthetic fluorophlogopite  is obtained by cooling and devitrification of chemical raw materials by high-temperature melting. The single wafer fraction is KMg3(AlSi3O10)F2, which belongs to the monoclinic system and is a typical layered silicate.
       
       KMg3(AlSi3O10)F2   is a typical layered silicate. Many of its properties are superior to natural mica. For example, when the temperature is higher than 1200°C, the volume resistivity of synthetic fluorophlogopite is 1000 times higher than that of natural mica under high temperature conditions. The electrical insulation is good, and the vacuum is very low at high temperatures. As well as being resistant to acids, alkalis, transparent, separable and flexible, it is an important non-metallic insulating material for modern industries and high-tech industries such as motors, electrical appliances, electronics, and aviation. 

      Specifications:
      • [KMg3(AlSi3O10)F2]  -synthetized fluorphlogopite mica
      • Size: 8 mm x 8 mm 
      • Thickness: 0.2 mm
      • Surface Finish: as cleaved
      Density 2.78~2.85 * 10^3 kg/m^3
      Volume Resitivity 10^15~10^16 Ω·cm
      Surface Resitivity 10^11~10^13 Ω
      Dielectric Strength 185~236kV/mm
      Permittivity 5.6 ε
      dielectric loss 1~4x 10^-4 tg δ
      Melting Point 1375 ± 5
      Max Working Temperature(Tmax) 1100
      Thermal Weight Loss (40 ~ 1180 0.85%
      Specific heat capacity 836 J/kg · K
      Linear Thermal Expansion () 10 ~ 12 x 10^-6/K
      (⊥) 15 ~ 25 x 10^-6/K
      Thermal conductivity () 3.75W/m·K
      (⊥) 0.55W/m·K
      optical axial angle 8° ~ 14°
      Hardness Mohs Hardness 3~3.4
      Microhardness Hv0.2 1.35GPa
      S 138~146
      refractive index N_p 1.513~1.544
      N_m 1.539~1.564
      N_g 1.540~1.566
      Ultimate tensile strength  150~200MPa
      Compressive strength 400~520MPa
      Water absorption 0.14~0.23%
      Moisture absorption 0~0.05%
      Mosaicity < 0.25

      Coefficient of Linear Thermal Expansion (x10^-6/K)
      Temperature 200 600 900
      Cleavage 10.0 6.3 2.96
      ⊥ Cleavage 21.2 11.5 5.08

      Volume Resitivity Under High Temperature (Ω·cm)
      Temperature Room temperature 300 500 600 700 800
      Volume Resitivity 3.9 x 10^15 5.1 x 10^13 1.6 x 10^13 1.6 x 10^12 5.6x10^11 3.9x10^10

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        Aluminum Nitride Substrates: AlN
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        Si3N4 Ceramic Substrates
        Silicon Nitride ( Si3N4) Substrate
        Alumina Ceramic Substrates  
        Aluminum Oxide Substrates Al2O3
        Corning Glass 
        Mica Disks Highest Grade V1
        Mica Disks Highest Grade V1
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        Silicon Nitride ( Si3N4) Substrate
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