KMg3(AlSi3O10)F2 -Synthetized fluorphlogopite, 100x20 x0.3 thick (mm) , as cleaved
Synthetic fluorophlogopite is obtained by cooling and devitrification of chemical raw materials by high-temperature melting. The single wafer fraction is KMg3(AlSi3O10)F2, which belongs to the monoclinic system and is a typically layered silicate.
 KMg3(AlSi3O10)F2 is a typical layered silicate. Many of its properties are superior to natural mica. For example, when the temperature is higher than 1200°C, the volume resistivity of synthetic fluorophlogopite is 1000 times higher than that of natural mica under high-temperature conditions. The electrical insulation is good, and the vacuum is very low at high temperatures. As well as being resistant to acids, alkalis, transparent, separable and flexible, it is an important non-metallic insulating material for modern industries and high-tech industries such as motors, electrical appliances, electronics, and aviation.Â
- KMg3(AlSi3O10)F2 -synthetized fluorophlogopite
- Size: 100 mm x 20 mmÂ
- Thickness: 0.3 mm
- Surface Finish:as cleaved
| Density | 2.78~2.85 * 10^3 kg/m^3 | |
| Volume Resitivity | 10^15~10^16 Ω·cm | |
| Surface Resitivity | 10^11~10^13 Ω | |
| Dielectric Strength | 185~236kV/mm | |
| Permittivity | 5.6 Δ | |
| dielectric loss | 1~4x 10^-4 tg ÎŽ | |
| Melting Point | 1375 ± 5 | |
| Max Working Temperature(Tmax) | 1100 | |
| Thermal Weight Loss (40 ~ 1180 | 0.85% | |
| Specific heat capacity | 836 J/kg · K | |
| Linear Thermal Expansion | () 10 ~ 12 x 10^-6/K | |
| (â„) 15 ~ 25 x 10^-6/K | ||
| Thermal conductivity | () 3.75W/m·K | |
| (â„) 0.55W/m·K | ||
| optical axial angle | 8° ~ 14° | |
| Hardness | Mohs Hardness | 3~3.4 |
| Microhardness Hv0.2 | 1.35GPa | |
| S | 138~146 | |
| refractive index | N_p | 1.513~1.544 |
| N_m | 1.539~1.564 | |
| N_g | 1.540~1.566 | |
| Ultimate tensile strength | 150~200MPa | |
| Compressive strength | 400~520MPa | |
| Water absorption | 0.14~0.23% | |
| Moisture absorption | 0~0.05% | |
| Mosaicity | < 0.25 | |
Coefficient of Linear Thermal Expansion (x10^-6/K)
| Temperature | 200 | 600 | 900 |
| Cleavage | 10.0 | 6.3 | 2.96 |
| â„ Cleavage | 21.2 | 11.5 | 5.08 |
Volume Resitivity Under High Temperature (Ω·cm)
| Temperature | Room temperature | 300 | 500 | 600 | 700 | 800 |
| Volume Resitivity | 3.9 x 10^15 | 5.1 x 10^13 | 1.6 x 10^13 | 1.6 x 10^12 | 5.6x10^11 | 3.9x10^10 |
|
AlN Ceramic Substrates
|
BK7 GlassÂ
 |
ITO Coated Glass / Plastic  |
Si3N4 Ceramic Substrates
|
|
Alumina Ceramic Substrates Â
|
Corning GlassÂ
 |
Mica Disks Highest Grade V1
 |
 SiC Ceramic Substrates  Â
|
|
BeO Ceramic Substrates
|
FTO Glass
|
Original: $329.00
-65%$329.00
$115.15KMg3(AlSi3O10)F2 -Synthetized fluorphlogopite, 100x20 x0.3 thick (mm) , as cleaved
Synthetic fluorophlogopite is obtained by cooling and devitrification of chemical raw materials by high-temperature melting. The single wafer fraction is KMg3(AlSi3O10)F2, which belongs to the monoclinic system and is a typically layered silicate.
 KMg3(AlSi3O10)F2 is a typical layered silicate. Many of its properties are superior to natural mica. For example, when the temperature is higher than 1200°C, the volume resistivity of synthetic fluorophlogopite is 1000 times higher than that of natural mica under high-temperature conditions. The electrical insulation is good, and the vacuum is very low at high temperatures. As well as being resistant to acids, alkalis, transparent, separable and flexible, it is an important non-metallic insulating material for modern industries and high-tech industries such as motors, electrical appliances, electronics, and aviation.Â
- KMg3(AlSi3O10)F2 -synthetized fluorophlogopite
- Size: 100 mm x 20 mmÂ
- Thickness: 0.3 mm
- Surface Finish:as cleaved
| Density | 2.78~2.85 * 10^3 kg/m^3 | |
| Volume Resitivity | 10^15~10^16 Ω·cm | |
| Surface Resitivity | 10^11~10^13 Ω | |
| Dielectric Strength | 185~236kV/mm | |
| Permittivity | 5.6 Δ | |
| dielectric loss | 1~4x 10^-4 tg ÎŽ | |
| Melting Point | 1375 ± 5 | |
| Max Working Temperature(Tmax) | 1100 | |
| Thermal Weight Loss (40 ~ 1180 | 0.85% | |
| Specific heat capacity | 836 J/kg · K | |
| Linear Thermal Expansion | () 10 ~ 12 x 10^-6/K | |
| (â„) 15 ~ 25 x 10^-6/K | ||
| Thermal conductivity | () 3.75W/m·K | |
| (â„) 0.55W/m·K | ||
| optical axial angle | 8° ~ 14° | |
| Hardness | Mohs Hardness | 3~3.4 |
| Microhardness Hv0.2 | 1.35GPa | |
| S | 138~146 | |
| refractive index | N_p | 1.513~1.544 |
| N_m | 1.539~1.564 | |
| N_g | 1.540~1.566 | |
| Ultimate tensile strength | 150~200MPa | |
| Compressive strength | 400~520MPa | |
| Water absorption | 0.14~0.23% | |
| Moisture absorption | 0~0.05% | |
| Mosaicity | < 0.25 | |
Coefficient of Linear Thermal Expansion (x10^-6/K)
| Temperature | 200 | 600 | 900 |
| Cleavage | 10.0 | 6.3 | 2.96 |
| â„ Cleavage | 21.2 | 11.5 | 5.08 |
Volume Resitivity Under High Temperature (Ω·cm)
| Temperature | Room temperature | 300 | 500 | 600 | 700 | 800 |
| Volume Resitivity | 3.9 x 10^15 | 5.1 x 10^13 | 1.6 x 10^13 | 1.6 x 10^12 | 5.6x10^11 | 3.9x10^10 |
|
AlN Ceramic Substrates
|
BK7 GlassÂ
|
ITO Coated Glass / Plastic |
Si3N4 Ceramic Substrates
|
|
Alumina Ceramic Substrates Â
|
Corning GlassÂ
|
Mica Disks Highest Grade V1
|
 SiC Ceramic Substrates  Â
|
|
BeO Ceramic Substrates
|
FTO Glass
|
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
Synthetic fluorophlogopite is obtained by cooling and devitrification of chemical raw materials by high-temperature melting. The single wafer fraction is KMg3(AlSi3O10)F2, which belongs to the monoclinic system and is a typically layered silicate.
 KMg3(AlSi3O10)F2 is a typical layered silicate. Many of its properties are superior to natural mica. For example, when the temperature is higher than 1200°C, the volume resistivity of synthetic fluorophlogopite is 1000 times higher than that of natural mica under high-temperature conditions. The electrical insulation is good, and the vacuum is very low at high temperatures. As well as being resistant to acids, alkalis, transparent, separable and flexible, it is an important non-metallic insulating material for modern industries and high-tech industries such as motors, electrical appliances, electronics, and aviation.Â
- KMg3(AlSi3O10)F2 -synthetized fluorophlogopite
- Size: 100 mm x 20 mmÂ
- Thickness: 0.3 mm
- Surface Finish:as cleaved
| Density | 2.78~2.85 * 10^3 kg/m^3 | |
| Volume Resitivity | 10^15~10^16 Ω·cm | |
| Surface Resitivity | 10^11~10^13 Ω | |
| Dielectric Strength | 185~236kV/mm | |
| Permittivity | 5.6 Δ | |
| dielectric loss | 1~4x 10^-4 tg ÎŽ | |
| Melting Point | 1375 ± 5 | |
| Max Working Temperature(Tmax) | 1100 | |
| Thermal Weight Loss (40 ~ 1180 | 0.85% | |
| Specific heat capacity | 836 J/kg · K | |
| Linear Thermal Expansion | () 10 ~ 12 x 10^-6/K | |
| (â„) 15 ~ 25 x 10^-6/K | ||
| Thermal conductivity | () 3.75W/m·K | |
| (â„) 0.55W/m·K | ||
| optical axial angle | 8° ~ 14° | |
| Hardness | Mohs Hardness | 3~3.4 |
| Microhardness Hv0.2 | 1.35GPa | |
| S | 138~146 | |
| refractive index | N_p | 1.513~1.544 |
| N_m | 1.539~1.564 | |
| N_g | 1.540~1.566 | |
| Ultimate tensile strength | 150~200MPa | |
| Compressive strength | 400~520MPa | |
| Water absorption | 0.14~0.23% | |
| Moisture absorption | 0~0.05% | |
| Mosaicity | < 0.25 | |
Coefficient of Linear Thermal Expansion (x10^-6/K)
| Temperature | 200 | 600 | 900 |
| Cleavage | 10.0 | 6.3 | 2.96 |
| â„ Cleavage | 21.2 | 11.5 | 5.08 |
Volume Resitivity Under High Temperature (Ω·cm)
| Temperature | Room temperature | 300 | 500 | 600 | 700 | 800 |
| Volume Resitivity | 3.9 x 10^15 | 5.1 x 10^13 | 1.6 x 10^13 | 1.6 x 10^12 | 5.6x10^11 | 3.9x10^10 |
|
AlN Ceramic Substrates
|
BK7 GlassÂ
|
ITO Coated Glass / Plastic |
Si3N4 Ceramic Substrates
|
|
Alumina Ceramic Substrates Â
|
Corning GlassÂ
|
Mica Disks Highest Grade V1
|
 SiC Ceramic Substrates  Â
|
|
BeO Ceramic Substrates
|
FTO Glass
|
