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Diamond on Silicon Wafer(DOS), 5x5mm , 2 um Thick, 10 nm Ra
Specifications:
- Wafer Size:5mmx5mmx0.5mm
- Silicon wafer Orientation: (100) + / - 0.5o
- Diamond film thickness: 2 micron
- Resistivity: 10E3 ~ 10E4 ohm-cm
- Surface roughness: one sides CMP polished with surface roughness < 10 nm
- Package: One 1000 class clean room with 100 class plastic bag
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$89.00
Diamond on Silicon Wafer(DOS), 5x5mm , 2 um Thick, 10 nm Ra—
$89.00
Diamond on Silicon Wafer(DOS), 5x5mm , 2 um Thick, 10 nm Ra
Specifications:
- Wafer Size:5mmx5mmx0.5mm
- Silicon wafer Orientation: (100) + / - 0.5o
- Diamond film thickness: 2 micron
- Resistivity: 10E3 ~ 10E4 ohm-cm
- Surface roughness: one sides CMP polished with surface roughness < 10 nm
- Package: One 1000 class clean room with 100 class plastic bag
Related Products
|
|
|
|
|
|
Thin Films A-Z |
Crystal wafer A-Z |
Plasma Cleaner |
Wafer Containers |
Dicing saw |
Film Coater |
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
Specifications:
- Wafer Size:5mmx5mmx0.5mm
- Silicon wafer Orientation: (100) + / - 0.5o
- Diamond film thickness: 2 micron
- Resistivity: 10E3 ~ 10E4 ohm-cm
- Surface roughness: one sides CMP polished with surface roughness < 10 nm
- Package: One 1000 class clean room with 100 class plastic bag
Related Products
|
|
|
|
|
|
Thin Films A-Z |
Crystal wafer A-Z |
Plasma Cleaner |
Wafer Containers |
Dicing saw |
Film Coater |
