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Diamond on Oxide Wafer(DOI), 5 mm x 5 mm, 2um Thick, 10nm Ra
Specifications:
- Film:UNCD (Ultrananocrystalline Diamond)
- Wafer Size: 5x5x0.5mm
-
Si wafer Orientation: (100) + / - 0.5o
-
Insulating Layer: SiO2
- Diamond film thickness: 2 microns, undoped
- Oxide Layer: 1 micron
-
Estimated Resistivity: ~ 10E5 ohm-cm
-
Surface Roughness: as grown , RA < 10 nm
-
Package: One 1000 class clean room with 100 class plastic bag
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$31.15
Original: $89.00
-65%Diamond on Oxide Wafer(DOI), 5 mm x 5 mm, 2um Thick, 10nm Ra—
$89.00
$31.15Diamond on Oxide Wafer(DOI), 5 mm x 5 mm, 2um Thick, 10nm Ra
Specifications:
- Film:UNCD (Ultrananocrystalline Diamond)
- Wafer Size: 5x5x0.5mm
-
Si wafer Orientation: (100) + / - 0.5o
-
Insulating Layer: SiO2
- Diamond film thickness: 2 microns, undoped
- Oxide Layer: 1 micron
-
Estimated Resistivity: ~ 10E5 ohm-cm
-
Surface Roughness: as grown , RA < 10 nm
-
Package: One 1000 class clean room with 100 class plastic bag
Related Products
|
|
|
|
|
|
|
Thin Films A-Z |
Crystal wafer A-Z |
Plasma Cleaner |
Wafer Containers |
Dicing saw |
Film Coater |
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
Specifications:
- Film:UNCD (Ultrananocrystalline Diamond)
- Wafer Size: 5x5x0.5mm
-
Si wafer Orientation: (100) + / - 0.5o
-
Insulating Layer: SiO2
- Diamond film thickness: 2 microns, undoped
- Oxide Layer: 1 micron
-
Estimated Resistivity: ~ 10E5 ohm-cm
-
Surface Roughness: as grown , RA < 10 nm
-
Package: One 1000 class clean room with 100 class plastic bag
Related Products
|
|
|
|
|
|
|
Thin Films A-Z |
Crystal wafer A-Z |
Plasma Cleaner |
Wafer Containers |
Dicing saw |
Film Coater |
