Diamond Wire of 0.42 mm Dia. x 80 m L for Wire Saw Cutting - EQ-DW042
Diamond wire cutting is a state-of-the-art technology to slice single crystal wafers or substrates. The diamond wire produces minimum kerf loss, less sub-surface damage, and contamination-free coolant during crystal cutting. Through several years of effort, finally, MTI provides the market a quality diamond wire at a reasonable price.
Specifications:
| Part Number | EQ-DW042x80 |
| Tensile Strength | 290 N |
| Features |
|
  |
Diamond Wire of 0.42 mm Dia. x 80 m L for Wire Saw Cutting - EQ-DW042
Diamond wire cutting is a state-of-the-art technology to slice single crystal wafers or substrates. The diamond wire produces minimum kerf loss, less sub-surface damage, and contamination-free coolant during crystal cutting. Through several years of effort, finally, MTI provides the market a quality diamond wire at a reasonable price.
Specifications:
| Part Number | EQ-DW042x80 |
| Tensile Strength | 290 N |
| Features |
|
|
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
Diamond wire cutting is a state-of-the-art technology to slice single crystal wafers or substrates. The diamond wire produces minimum kerf loss, less sub-surface damage, and contamination-free coolant during crystal cutting. Through several years of effort, finally, MTI provides the market a quality diamond wire at a reasonable price.
Specifications:
| Part Number | EQ-DW042x80 |
| Tensile Strength | 290 N |
| Features |
|
|
