Diamond Wire of 0.125 mm Dia. x 65 m L (215 feet) for Wire Saw Cutting - DW0125x65
Diamond wire cutting is a state-of-the-art technology to slice a single crystal wafer or substrate. The diamond wire produces minimum kerf loss, less sub-surface damage, and contamination-free coolant during crystal cutting. Through several years of effort, finally, MTI provides the market a quality diamond wire at a reasonable price.
Specifications:
| Part Number | EQ-DW0125x65 |
| Tensile Strength | 30 N |
| Features |
|
|
Original: $98.00
-65%$98.00
$34.30Diamond Wire of 0.125 mm Dia. x 65 m L (215 feet) for Wire Saw Cutting - DW0125x65
Diamond wire cutting is a state-of-the-art technology to slice a single crystal wafer or substrate. The diamond wire produces minimum kerf loss, less sub-surface damage, and contamination-free coolant during crystal cutting. Through several years of effort, finally, MTI provides the market a quality diamond wire at a reasonable price.
Specifications:
| Part Number | EQ-DW0125x65 |
| Tensile Strength | 30 N |
| Features |
|
|
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
Diamond wire cutting is a state-of-the-art technology to slice a single crystal wafer or substrate. The diamond wire produces minimum kerf loss, less sub-surface damage, and contamination-free coolant during crystal cutting. Through several years of effort, finally, MTI provides the market a quality diamond wire at a reasonable price.
Specifications:
| Part Number | EQ-DW0125x65 |
| Tensile Strength | 30 N |
| Features |
|
|
