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Diamond Wire of 0.25 mm Dia.with Optional Length for Wire Saw Cutting -Made in USA - EQ-DW025

Diamond Wire of 0.25 mm Dia.with Optional Length for Wire Saw Cutting -Made in USA - EQ-DW025

Diamond Wire of 0.25 mm Dia.with Optional Length for Wire Saw Cutting -Made in USA - EQ-DW025

Diamond wire cutting is a state of the art technology to slice a single crystal wafer or substrate. The diamond wire produces minimum kerf loss, less sub-surface damage, and contaminant-free coolant during crystal cutting. Through several years of effort, finally, MTI provides the market a quality diamond wire at a reasonable price.

Specifications:

Part Number	EQ-DW025
Tensile Strength	75 N
Features	Electroplated diamond wire with 0.25 mm (+/-0.02) diameter based on a high strength steel wire 80 microns diamond particle for effectively cutting and slicing of ceramic and crystal 65 mete (215 feet) or 100 meters (333 feet) or 200 meters (656 feet) per roll as a standard package Perfect for cutting Sapphire or SiC single crystal Super quality Made in the USA Suitable for diamond wire saws, including Well-Diamond, Diamond Wire Technology, MTI etc.
Test Result From Multiwire Diamond Saw	3" sapphire, 200 / ingot cutting time is about 5 hours 3" SiC, single wafer slicing, cutting time is about 6 hours
	Please click here to order other side diamond wire Please order a dressing stone to sharpen wire during cutting

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From $52.15

Original: $149.00

-65%

Diamond Wire of 0.25 mm Dia.with Optional Length for Wire Saw Cutting -Made in USA - EQ-DW025—

$149.00

$52.15

Diamond Wire of 0.25 mm Dia.with Optional Length for Wire Saw Cutting -Made in USA - EQ-DW025

Diamond wire cutting is a state of the art technology to slice a single crystal wafer or substrate. The diamond wire produces minimum kerf loss, less sub-surface damage, and contaminant-free coolant during crystal cutting. Through several years of effort, finally, MTI provides the market a quality diamond wire at a reasonable price.

Specifications:

Part Number	EQ-DW025
Tensile Strength	75 N
Features	Electroplated diamond wire with 0.25 mm (+/-0.02) diameter based on a high strength steel wire 80 microns diamond particle for effectively cutting and slicing of ceramic and crystal 65 mete (215 feet) or 100 meters (333 feet) or 200 meters (656 feet) per roll as a standard package Perfect for cutting Sapphire or SiC single crystal Super quality Made in the USA Suitable for diamond wire saws, including Well-Diamond, Diamond Wire Technology, MTI etc.
Test Result From Multiwire Diamond Saw	3" sapphire, 200 / ingot cutting time is about 5 hours 3" SiC, single wafer slicing, cutting time is about 6 hours
	Please click here to order other side diamond wire Please order a dressing stone to sharpen wire during cutting

Product Information

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Description

Diamond wire cutting is a state of the art technology to slice a single crystal wafer or substrate. The diamond wire produces minimum kerf loss, less sub-surface damage, and contaminant-free coolant during crystal cutting. Through several years of effort, finally, MTI provides the market a quality diamond wire at a reasonable price.

Specifications:

Part Number	EQ-DW025
Tensile Strength	75 N
Features	Electroplated diamond wire with 0.25 mm (+/-0.02) diameter based on a high strength steel wire 80 microns diamond particle for effectively cutting and slicing of ceramic and crystal 65 mete (215 feet) or 100 meters (333 feet) or 200 meters (656 feet) per roll as a standard package Perfect for cutting Sapphire or SiC single crystal Super quality Made in the USA Suitable for diamond wire saws, including Well-Diamond, Diamond Wire Technology, MTI etc.
Test Result From Multiwire Diamond Saw	3" sapphire, 200 / ingot cutting time is about 5 hours 3" SiC, single wafer slicing, cutting time is about 6 hours
	Please click here to order other side diamond wire Please order a dressing stone to sharpen wire during cutting

Diamond Wire of 0.25 mm Dia.with Optional Length for Wire Saw Cutting -Made in USA - EQ-DW025 | MTI Online Store