Aluminum Film on Silicon Wafer, 3 microns / 4" -- Al-Si-100-3um ,Si(100) N-type, R:<0.005 ohm.cm - FmAlonSiAsa101D0525C1FT3um
Aluminum Film on Silicon Wafer, 3 microns / 4" -- Al-Si-100-3um ,Si(100) N-type, R:<0.005 ohm.cm - FmAlonSiAsa101D0525C1FT3um
Aluminum Metallic Film
- Film coated by E-beam evaporation under vacuum below 1xE-6 torr
- evaporation rate: 0.2 nanometer per second
- Aluminum Thickness: 3 microns
- Film Crystallinity: Weak (111) - oriented polycrystals
Silicon Wafer Specifications:
- Conductive type: Si N- type As-doped
- Resistivity: <0.005 ohm-cm
- Size: 4" diameter x 0.525 mm th
- Orientation: (100) +/- 0.5o
- Polish: One sides polished
- Surface roughness: Prime
- Packing: Vacuum packed on a 4" single wafer carrier
- Optional: you may need tool below to handle the wafer ( click picture to order )
Diamond Scriber for Cutting Single Crystal Substrate |
Micro-Fiber & Dust Free Wiper, 4"x4", 100 pcs/bag |
Vacuum Pen SMT-150C (NEW) - |
Single Wafer Containers |
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Original: $475.00
-65%$475.00
$166.25Aluminum Film on Silicon Wafer, 3 microns / 4" -- Al-Si-100-3um ,Si(100) N-type, R:<0.005 ohm.cm - FmAlonSiAsa101D0525C1FT3um
Aluminum Metallic Film
- Film coated by E-beam evaporation under vacuum below 1xE-6 torr
- evaporation rate: 0.2 nanometer per second
- Aluminum Thickness: 3 microns
- Film Crystallinity: Weak (111) - oriented polycrystals
Silicon Wafer Specifications:
- Conductive type: Si N- type As-doped
- Resistivity: <0.005 ohm-cm
- Size: 4" diameter x 0.525 mm th
- Orientation: (100) +/- 0.5o
- Polish: One sides polished
- Surface roughness: Prime
- Packing: Vacuum packed on a 4" single wafer carrier
- Optional: you may need tool below to handle the wafer ( click picture to order )
Diamond Scriber for Cutting Single Crystal Substrate |
Micro-Fiber & Dust Free Wiper, 4"x4", 100 pcs/bag |
Vacuum Pen SMT-150C (NEW) - |
Single Wafer Containers |
Related Products
Thin Films A-Z |
Crystal wafer A-Z |
Plasma Cleaner |
Wafer Containers |
Dicing saw |
Film Coater |
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
Aluminum Metallic Film
- Film coated by E-beam evaporation under vacuum below 1xE-6 torr
- evaporation rate: 0.2 nanometer per second
- Aluminum Thickness: 3 microns
- Film Crystallinity: Weak (111) - oriented polycrystals
Silicon Wafer Specifications:
- Conductive type: Si N- type As-doped
- Resistivity: <0.005 ohm-cm
- Size: 4" diameter x 0.525 mm th
- Orientation: (100) +/- 0.5o
- Polish: One sides polished
- Surface roughness: Prime
- Packing: Vacuum packed on a 4" single wafer carrier
- Optional: you may need tool below to handle the wafer ( click picture to order )
Diamond Scriber for Cutting Single Crystal Substrate |
Micro-Fiber & Dust Free Wiper, 4"x4", 100 pcs/bag |
Vacuum Pen SMT-150C (NEW) - |
Single Wafer Containers |
Related Products
Thin Films A-Z |
Crystal wafer A-Z |
Plasma Cleaner |
Wafer Containers |
Dicing saw |
Film Coater |

