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15" Poromeric Polishing Pad (PSA) for Final Polishing - PP15PSA
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15" Poromeric Polishing Pad (PSA) for Final Polishing - PP15PSA

15" Poromeric Polishing Pad (PSA) for Final Polishing - PP15PSA

Poromeric pad is made of napped none-woven materials with uniform pore structure and wall strength. The standard sizes of poromeric polishing pads are 8", 10" ,12" and 15".Ā 

SpecificationĀ 

Size
  • 15"
Thickness
  • 1.65mmĀ 
Tear Strength Machine Direction: 57N
Transverse Direction: 56N
ElongationĀ  Machine Direction: 53%
Transverse Direction: 86%
Tensile StrengthĀ  Machine Direction: 642 N/3cm (force applied within a 3 cm range)
Transverse Direction: 511 N/3cm (force applied within a 3 cm range)
Application
  • Final polishing of LiNbO3 and Sapphire wafers
  • Final polishing in CMP for semiconductors and oxide crystals.
  • EPI polishing for all single crystal substrates.

Ā 

Ā 

$10.48

Original: $29.95

-65%
15" Poromeric Polishing Pad (PSA) for Final Polishing - PP15PSAā€”

$29.95

$10.48

15" Poromeric Polishing Pad (PSA) for Final Polishing - PP15PSA

Poromeric pad is made of napped none-woven materials with uniform pore structure and wall strength. The standard sizes of poromeric polishing pads are 8", 10" ,12" and 15".Ā 

SpecificationĀ 

Size
  • 15"
Thickness
  • 1.65mmĀ 
Tear Strength Machine Direction: 57N
Transverse Direction: 56N
ElongationĀ  Machine Direction: 53%
Transverse Direction: 86%
Tensile StrengthĀ  Machine Direction: 642 N/3cm (force applied within a 3 cm range)
Transverse Direction: 511 N/3cm (force applied within a 3 cm range)
Application
  • Final polishing of LiNbO3 and Sapphire wafers
  • Final polishing in CMP for semiconductors and oxide crystals.
  • EPI polishing for all single crystal substrates.

Ā 

Ā 

Product Information

Shipping & Returns

Description

Poromeric pad is made of napped none-woven materials with uniform pore structure and wall strength. The standard sizes of poromeric polishing pads are 8", 10" ,12" and 15".Ā 

SpecificationĀ 

Size
  • 15"
Thickness
  • 1.65mmĀ 
Tear Strength Machine Direction: 57N
Transverse Direction: 56N
ElongationĀ  Machine Direction: 53%
Transverse Direction: 86%
Tensile StrengthĀ  Machine Direction: 642 N/3cm (force applied within a 3 cm range)
Transverse Direction: 511 N/3cm (force applied within a 3 cm range)
Application
  • Final polishing of LiNbO3 and Sapphire wafers
  • Final polishing in CMP for semiconductors and oxide crystals.
  • EPI polishing for all single crystal substrates.

Ā 

Ā 

15" Poromeric Polishing Pad (PSA) for Final Polishing - PP15PSA | MTI Online Store