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1" Copper Backing Plate - EQ-CBP-1
Copper Backing PlateĀ is used for improving the conductivity of the nonmetallicĀ plasma sputtering targets.
SPECIFICATION
SPECIFICATION
| Chemical Symbol | Copper |
| Thickness | 2.3 mm |
| Weight | 1 oz |
| Color | Reddish Brown |
| Application Notes | Used for bonding with nonmetallic sputtering targets. |
| Operation Instructions | Ā  Ā Ā Ā  |
$63.00
Original: $180.00
-65%1" Copper Backing Plate - EQ-CBP-1ā
$180.00
$63.001" Copper Backing Plate - EQ-CBP-1
Copper Backing PlateĀ is used for improving the conductivity of the nonmetallicĀ plasma sputtering targets.
SPECIFICATION
SPECIFICATION
| Chemical Symbol | Copper |
| Thickness | 2.3 mm |
| Weight | 1 oz |
| Color | Reddish Brown |
| Application Notes | Used for bonding with nonmetallic sputtering targets. |
| Operation Instructions | Ā Ā Ā Ā |
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
Copper Backing PlateĀ is used for improving the conductivity of the nonmetallicĀ plasma sputtering targets.
SPECIFICATION
SPECIFICATION
| Chemical Symbol | Copper |
| Thickness | 2.3 mm |
| Weight | 1 oz |
| Color | Reddish Brown |
| Application Notes | Used for bonding with nonmetallic sputtering targets. |
| Operation Instructions | Ā Ā Ā Ā |
