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High Conductive Silver Epoxy for Target Bonding -SP-05000-AB-LD
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High Conductive Silver Epoxy for Target Bonding -SP-05000-AB-LD

High Conductive Silver Epoxy for Target Bonding -SP-05000-AB-LD

The silver epoxy is ideal for bonding the nonmetallicĀ plasma sputtering targets and the copper backing plate. TheĀ silver epoxy is mixed at a non-critical 1 to 1 ratio by weight or volume, and it will provide a quick conductive bond at or above room temperature. Typical cure times are approximately 4 hours at 75Ā°C.
SPECIFICATION
Model Silver Epoxy
Conductivity
  • Volume Resistivity < 0.001 ohm-cm
  • Excellent electrical conductivity
  • High-strength conductive bonding
Weight 14 g (0.5 oz) total
Color Silver
Shelf Life 9 months
Curing
  • Small amounts can take several hours to cure at room temperature.Ā 
  • Cure times can be accelerated by heating.
  • For the fastest curing times, maximum conductivity and adhesion, heat the bond to between 175Ā° - 250Ā°F (79Ā° - 121Ā°C) for 10 minutes and allow to cool
Operation Instructions

Please click video to learn how to bond a target with backing plate )		 Ā  Ā  Ā  Ā  Ā  Ā  Ā Ā Ā  Ā Ā 
Application Notes
  • Causes eye and skin burns. Harmful if absorbed through the skin. Causes Respiratory tract irritation. May cause allergic skin reaction.
  • Do not try to cure below 75Ā°F/24Ā°C.
  • Working temperature range is -131Ā° to 212Ā°F (-55Ā° to 100Ā°C).
  • Typical working pot life is 10 minutes from mixing.
  • Please emailĀ us to learn about Iridium Solder Bonding
  • Please click here to find target from A-Z
$76.99

Original: $219.98

-65%
High Conductive Silver Epoxy for Target Bonding -SP-05000-AB-LDā€”

$219.98

$76.99

High Conductive Silver Epoxy for Target Bonding -SP-05000-AB-LD

The silver epoxy is ideal for bonding the nonmetallicĀ plasma sputtering targets and the copper backing plate. TheĀ silver epoxy is mixed at a non-critical 1 to 1 ratio by weight or volume, and it will provide a quick conductive bond at or above room temperature. Typical cure times are approximately 4 hours at 75Ā°C.
SPECIFICATION
Model Silver Epoxy
Conductivity
  • Volume Resistivity < 0.001 ohm-cm
  • Excellent electrical conductivity
  • High-strength conductive bonding
Weight 14 g (0.5 oz) total
Color Silver
Shelf Life 9 months
Curing
  • Small amounts can take several hours to cure at room temperature.Ā 
  • Cure times can be accelerated by heating.
  • For the fastest curing times, maximum conductivity and adhesion, heat the bond to between 175Ā° - 250Ā°F (79Ā° - 121Ā°C) for 10 minutes and allow to cool
Operation Instructions

Please click video to learn how to bond a target with backing plate )		 Ā  Ā  Ā  Ā  Ā  Ā  Ā Ā Ā  Ā Ā 
Application Notes
  • Causes eye and skin burns. Harmful if absorbed through the skin. Causes Respiratory tract irritation. May cause allergic skin reaction.
  • Do not try to cure below 75Ā°F/24Ā°C.
  • Working temperature range is -131Ā° to 212Ā°F (-55Ā° to 100Ā°C).
  • Typical working pot life is 10 minutes from mixing.
  • Please emailĀ us to learn about Iridium Solder Bonding
  • Please click here to find target from A-Z

Product Information

Shipping & Returns

Description

The silver epoxy is ideal for bonding the nonmetallicĀ plasma sputtering targets and the copper backing plate. TheĀ silver epoxy is mixed at a non-critical 1 to 1 ratio by weight or volume, and it will provide a quick conductive bond at or above room temperature. Typical cure times are approximately 4 hours at 75Ā°C.
SPECIFICATION
Model Silver Epoxy
Conductivity
  • Volume Resistivity < 0.001 ohm-cm
  • Excellent electrical conductivity
  • High-strength conductive bonding
Weight 14 g (0.5 oz) total
Color Silver
Shelf Life 9 months
Curing
  • Small amounts can take several hours to cure at room temperature.Ā 
  • Cure times can be accelerated by heating.
  • For the fastest curing times, maximum conductivity and adhesion, heat the bond to between 175Ā° - 250Ā°F (79Ā° - 121Ā°C) for 10 minutes and allow to cool
Operation Instructions

Please click video to learn how to bond a target with backing plate )		 Ā  Ā  Ā  Ā  Ā  Ā  Ā Ā Ā  Ā Ā 
Application Notes
  • Causes eye and skin burns. Harmful if absorbed through the skin. Causes Respiratory tract irritation. May cause allergic skin reaction.
  • Do not try to cure below 75Ā°F/24Ā°C.
  • Working temperature range is -131Ā° to 212Ā°F (-55Ā° to 100Ā°C).
  • Typical working pot life is 10 minutes from mixing.
  • Please emailĀ us to learn about Iridium Solder Bonding
  • Please click here to find target from A-Z
High Conductive Silver Epoxy for Target Bonding -SP-05000-AB-LD | MTI Online Store