Silicon Nitride Film (LPCVD) on Corning 7980, Film thickness: 1.3um ,10x10x0.5mm
Silicon Nitride Film
- Si3N4 Film coated by low stress LPCVD method
- Si3N4 Thickness:Ā Ā 1.3umĀ +/- 5%
-
Si3N4 covers both side on Corning 7980 0F fused silica Ā ( Warning: the Si3N4 film may have stressed induced micro-cracking resulted from the large difference of thermal expansion coefficient between Si3N4 and SiO2 fused silica )
Ā
ā¢ UV Grade Fused Silica (Corning 0F 7980 HPFS)
ā¢ Size: 10x10x0.5mm
ā¢ Edge: CNC Ground
ā¢ Surface Quality: 60/40 or beer
ā¢ Non-effective Area: 2.0 mm border
ā¢ TTV: < 20 microns
ā¢ Polishing: Two sides polished (60/40)
ā¢ Average Surface Roughness Ra: =< 5 A RMS
-
Optional:Ā you may need tool below to handle the wafer ( click picture to order )
Diamond Scriber for Cutting Single Crystal Substrate - DS-01
Micro-Fiber & Dust Free Wiper, 4"x4", 100 pcs/bag - Wiper-yx-2001
Vacuum Pen SMT-150C (NEW) - EQ-SMT-150C
Single Wafer Containers
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Original: $89.00
-65%$89.00
$31.15Silicon Nitride Film (LPCVD) on Corning 7980, Film thickness: 1.3um ,10x10x0.5mm
Silicon Nitride Film
- Si3N4 Film coated by low stress LPCVD method
- Si3N4 Thickness:Ā Ā 1.3umĀ +/- 5%
-
Si3N4 covers both side on Corning 7980 0F fused silica Ā ( Warning: the Si3N4 film may have stressed induced micro-cracking resulted from the large difference of thermal expansion coefficient between Si3N4 and SiO2 fused silica )
Ā
ā¢ UV Grade Fused Silica (Corning 0F 7980 HPFS)
ā¢ Size: 10x10x0.5mm
ā¢ Edge: CNC Ground
ā¢ Surface Quality: 60/40 or beer
ā¢ Non-effective Area: 2.0 mm border
ā¢ TTV: < 20 microns
ā¢ Polishing: Two sides polished (60/40)
ā¢ Average Surface Roughness Ra: =< 5 A RMS
-
Optional:Ā you may need tool below to handle the wafer ( click picture to order )
Diamond Scriber for Cutting Single Crystal Substrate - DS-01
Micro-Fiber & Dust Free Wiper, 4"x4", 100 pcs/bag - Wiper-yx-2001
Vacuum Pen SMT-150C (NEW) - EQ-SMT-150C
Single Wafer Containers
Related Products
|
|
|
|
|
|
Thin Films Ā A-Z |
Crystal wafer A-Z |
Plasma Cleaner |
Wafer Containers |
Dicing saw |
Film Coater |
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
Silicon Nitride Film
- Si3N4 Film coated by low stress LPCVD method
- Si3N4 Thickness:Ā Ā 1.3umĀ +/- 5%
-
Si3N4 covers both side on Corning 7980 0F fused silica Ā ( Warning: the Si3N4 film may have stressed induced micro-cracking resulted from the large difference of thermal expansion coefficient between Si3N4 and SiO2 fused silica )
Ā
ā¢ UV Grade Fused Silica (Corning 0F 7980 HPFS)
ā¢ Size: 10x10x0.5mm
ā¢ Edge: CNC Ground
ā¢ Surface Quality: 60/40 or beer
ā¢ Non-effective Area: 2.0 mm border
ā¢ TTV: < 20 microns
ā¢ Polishing: Two sides polished (60/40)
ā¢ Average Surface Roughness Ra: =< 5 A RMS
-
Optional:Ā you may need tool below to handle the wafer ( click picture to order )
Diamond Scriber for Cutting Single Crystal Substrate - DS-01
Micro-Fiber & Dust Free Wiper, 4"x4", 100 pcs/bag - Wiper-yx-2001
Vacuum Pen SMT-150C (NEW) - EQ-SMT-150C
Single Wafer Containers
Related Products
|
|
|
|
|
|
Thin Films Ā A-Z |
Crystal wafer A-Z |
Plasma Cleaner |
Wafer Containers |
Dicing saw |
Film Coater |
