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Stainless Steel Substrate (SUS301 HV200-HV600 ): 1" Dia x 0.3 mm, as cold rolling
-
Polycrystal SS301 stainless steel substrate SUS301 HV200-HV60)
- Substrate dimension: 25.4 diameter x 0.3 mm thickness, ( 1" Dia. x0.3 mm)
- Properties
- Yield Strength:N/mm2≥205
- Tensile strength :≥520
- Elogation: %≥40
- Density : 7.93 g·cm-3
- Resistivity: 0.73 Ω·mm2·m-1
- Melting Point: 13981420
- roughness: as Cold Rolling
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$19.95
Stainless Steel Substrate (SUS301 HV200-HV600 ): 1" Dia x 0.3 mm, as cold rolling—
$19.95
Stainless Steel Substrate (SUS301 HV200-HV600 ): 1" Dia x 0.3 mm, as cold rolling
-
Polycrystal SS301 stainless steel substrate SUS301 HV200-HV60)
- Substrate dimension: 25.4 diameter x 0.3 mm thickness, ( 1" Dia. x0.3 mm)
- Properties
- Yield Strength:N/mm2≥205
- Tensile strength :≥520
- Elogation: %≥40
- Density : 7.93 g·cm-3
- Resistivity: 0.73 Ω·mm2·m-1
- Melting Point: 13981420
- roughness: as Cold Rolling
Related Product
|
Metallic Substrate A-Z |
Plasma Cleaner |
Wafer Containers |
Dicing saw |
Film Coater |
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Product Information
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Description
-
Polycrystal SS301 stainless steel substrate SUS301 HV200-HV60)
- Substrate dimension: 25.4 diameter x 0.3 mm thickness, ( 1" Dia. x0.3 mm)
- Properties
- Yield Strength:N/mm2≥205
- Tensile strength :≥520
- Elogation: %≥40
- Density : 7.93 g·cm-3
- Resistivity: 0.73 Ω·mm2·m-1
- Melting Point: 13981420
- roughness: as Cold Rolling
Related Product
|
Metallic Substrate A-Z |
Plasma Cleaner |
Wafer Containers |
Dicing saw |
Film Coater |
