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InAs (411), S doped ellipse shape wafer (area >30mm dia) 1sp - IAS411ellipes
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InAs (411), S doped ellipse shape wafer (area >30mm dia) 1sp - IAS411ellipes

InAs (411), S doped ellipse shape wafer (area >30mm dia) 1sp - IAS411ellipes

  • Growth method                                     LEC
  • Orientation                                            (411)  ± 0.5  Deg
  • Orientation Flat                                     N/A              
  •  Doping                                                  S doped
  • Conductivity type                                   N type
  • Carrier Concentration                            <7E17 ~ 1E18 / cm3
  •  Mobility                                                >10000 cm2/V.S  
  • EPD                                                     <2E4 / cm 2
  • Standard thickness                                 500 ± 20 mm
  • Size                                                      ellipse shape, (area > 30mm diameter)
  • Polish                                                   one-side


Related Product

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InSb

InP 

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GaSb



Wafer Box

Film Coater

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$209.65

Original: $599.00

-65%
InAs (411), S doped ellipse shape wafer (area >30mm dia) 1sp - IAS411ellipes

$599.00

$209.65

InAs (411), S doped ellipse shape wafer (area >30mm dia) 1sp - IAS411ellipes

  • Growth method                                     LEC
  • Orientation                                            (411)  ± 0.5  Deg
  • Orientation Flat                                     N/A              
  •  Doping                                                  S doped
  • Conductivity type                                   N type
  • Carrier Concentration                            <7E17 ~ 1E18 / cm3
  •  Mobility                                                >10000 cm2/V.S  
  • EPD                                                     <2E4 / cm 2
  • Standard thickness                                 500 ± 20 mm
  • Size                                                      ellipse shape, (area > 30mm diameter)
  • Polish                                                   one-side


Related Product

Other InAs

InSb

InP 

GaAs


GaSb



Wafer Box

Film Coater

RTP Furnaces

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Description

  • Growth method                                     LEC
  • Orientation                                            (411)  ± 0.5  Deg
  • Orientation Flat                                     N/A              
  •  Doping                                                  S doped
  • Conductivity type                                   N type
  • Carrier Concentration                            <7E17 ~ 1E18 / cm3
  •  Mobility                                                >10000 cm2/V.S  
  • EPD                                                     <2E4 / cm 2
  • Standard thickness                                 500 ± 20 mm
  • Size                                                      ellipse shape, (area > 30mm diameter)
  • Polish                                                   one-side


Related Product

Other InAs

InSb

InP 

GaAs


GaSb



Wafer Box

Film Coater

RTP Furnaces